JPS58160129A - 樹脂モ−ルド成形におけるゲ−トの割れ残り防止方法 - Google Patents
樹脂モ−ルド成形におけるゲ−トの割れ残り防止方法Info
- Publication number
- JPS58160129A JPS58160129A JP4324882A JP4324882A JPS58160129A JP S58160129 A JPS58160129 A JP S58160129A JP 4324882 A JP4324882 A JP 4324882A JP 4324882 A JP4324882 A JP 4324882A JP S58160129 A JPS58160129 A JP S58160129A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molding
- gate
- mold
- semiconductor devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 31
- 239000011347 resin Substances 0.000 title claims abstract description 31
- 238000000465 moulding Methods 0.000 title claims abstract description 21
- 230000002265 prevention Effects 0.000 title description 3
- 238000000926 separation method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 claims abstract description 15
- 238000005452 bending Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 210000001747 pupil Anatomy 0.000 description 2
- 240000001548 Camellia japonica Species 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 235000017284 Pometia pinnata Nutrition 0.000 description 1
- 240000007653 Pometia tomentosa Species 0.000 description 1
- 235000018597 common camellia Nutrition 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/38—Cutting-off equipment for sprues or ingates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4324882A JPS58160129A (ja) | 1982-03-17 | 1982-03-17 | 樹脂モ−ルド成形におけるゲ−トの割れ残り防止方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4324882A JPS58160129A (ja) | 1982-03-17 | 1982-03-17 | 樹脂モ−ルド成形におけるゲ−トの割れ残り防止方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58160129A true JPS58160129A (ja) | 1983-09-22 |
| JPS636333B2 JPS636333B2 (enrdf_load_stackoverflow) | 1988-02-09 |
Family
ID=12658575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4324882A Granted JPS58160129A (ja) | 1982-03-17 | 1982-03-17 | 樹脂モ−ルド成形におけるゲ−トの割れ残り防止方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58160129A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63124426A (ja) * | 1986-11-12 | 1988-05-27 | Nec Kyushu Ltd | 半導体樹脂封止装置 |
| US4888307A (en) * | 1986-08-27 | 1989-12-19 | Sgs Microelettronica S.P.A. | Method for manufacturing plastic encapsulated semiconductor devices |
| JPH07156215A (ja) * | 1993-12-10 | 1995-06-20 | Nec Corp | 樹脂封止半導体装置用ゲート分離装置 |
| US6187247B1 (en) | 1998-05-13 | 2001-02-13 | Velcro Industries B.V. | Injection molding parts with fastener elements |
| JP2008118012A (ja) * | 2006-11-07 | 2008-05-22 | Apic Yamada Corp | ディゲート装置及びディゲート方法 |
-
1982
- 1982-03-17 JP JP4324882A patent/JPS58160129A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4888307A (en) * | 1986-08-27 | 1989-12-19 | Sgs Microelettronica S.P.A. | Method for manufacturing plastic encapsulated semiconductor devices |
| JPS63124426A (ja) * | 1986-11-12 | 1988-05-27 | Nec Kyushu Ltd | 半導体樹脂封止装置 |
| JPH07156215A (ja) * | 1993-12-10 | 1995-06-20 | Nec Corp | 樹脂封止半導体装置用ゲート分離装置 |
| US6187247B1 (en) | 1998-05-13 | 2001-02-13 | Velcro Industries B.V. | Injection molding parts with fastener elements |
| JP2008118012A (ja) * | 2006-11-07 | 2008-05-22 | Apic Yamada Corp | ディゲート装置及びディゲート方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS636333B2 (enrdf_load_stackoverflow) | 1988-02-09 |
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