JPS58159751U - ヒ−トシンク機構付半導体パツケ−ジ - Google Patents
ヒ−トシンク機構付半導体パツケ−ジInfo
- Publication number
- JPS58159751U JPS58159751U JP5813882U JP5813882U JPS58159751U JP S58159751 U JPS58159751 U JP S58159751U JP 5813882 U JP5813882 U JP 5813882U JP 5813882 U JP5813882 U JP 5813882U JP S58159751 U JPS58159751 U JP S58159751U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- sink mechanism
- semiconductor package
- semiconductor chip
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5813882U JPS58159751U (ja) | 1982-04-20 | 1982-04-20 | ヒ−トシンク機構付半導体パツケ−ジ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5813882U JPS58159751U (ja) | 1982-04-20 | 1982-04-20 | ヒ−トシンク機構付半導体パツケ−ジ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58159751U true JPS58159751U (ja) | 1983-10-25 |
JPS6233336Y2 JPS6233336Y2 (enrdf_load_stackoverflow) | 1987-08-26 |
Family
ID=30068543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5813882U Granted JPS58159751U (ja) | 1982-04-20 | 1982-04-20 | ヒ−トシンク機構付半導体パツケ−ジ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58159751U (enrdf_load_stackoverflow) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5512431U (enrdf_load_stackoverflow) * | 1978-07-12 | 1980-01-26 | ||
JPS57111054A (en) * | 1980-12-27 | 1982-07-10 | Toshiba Corp | Semiconductor device |
-
1982
- 1982-04-20 JP JP5813882U patent/JPS58159751U/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5512431U (enrdf_load_stackoverflow) * | 1978-07-12 | 1980-01-26 | ||
JPS57111054A (en) * | 1980-12-27 | 1982-07-10 | Toshiba Corp | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS6233336Y2 (enrdf_load_stackoverflow) | 1987-08-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS58159751U (ja) | ヒ−トシンク機構付半導体パツケ−ジ | |
JPS5845336U (ja) | セラミツク部材と金属部材の組付け構造 | |
JPS6327052U (enrdf_load_stackoverflow) | ||
JPS59152740U (ja) | 低熱抵抗ハ−メチツクパツケ−ジ | |
JPH0436246U (enrdf_load_stackoverflow) | ||
JPH0176057U (enrdf_load_stackoverflow) | ||
JPS596052U (ja) | 鋳造用チツプ | |
JPS60121650U (ja) | チツプキヤリア | |
JPS63195745U (enrdf_load_stackoverflow) | ||
JPS5991742U (ja) | 半導体用パツケ−ジ | |
JPH0176054U (enrdf_load_stackoverflow) | ||
JPS59107157U (ja) | GaAs半導体装置 | |
JPS60106375U (ja) | 外部リ−ド端子の取付構造 | |
JPS63164236U (enrdf_load_stackoverflow) | ||
JPS5999447U (ja) | 半導体用パツケ−ジ | |
JPS63127129U (enrdf_load_stackoverflow) | ||
JPS59131163U (ja) | 半導体容器 | |
JPS6066041U (ja) | Icパツケ−ジ | |
JPH01115247U (enrdf_load_stackoverflow) | ||
JPH0325247U (enrdf_load_stackoverflow) | ||
JPH0247054U (enrdf_load_stackoverflow) | ||
JPS6324842U (enrdf_load_stackoverflow) | ||
JPS6068656U (ja) | 放熱板付半導体装置 | |
JPS60124094U (ja) | 印刷配線基板 | |
JPS59159952U (ja) | ヒ−トシンク構造 |