JPS63195745U - - Google Patents
Info
- Publication number
- JPS63195745U JPS63195745U JP1987086731U JP8673187U JPS63195745U JP S63195745 U JPS63195745 U JP S63195745U JP 1987086731 U JP1987086731 U JP 1987086731U JP 8673187 U JP8673187 U JP 8673187U JP S63195745 U JPS63195745 U JP S63195745U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- semiconductor device
- semiconductor
- chip
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims 4
- 238000005476 soldering Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987086731U JPS63195745U (enrdf_load_stackoverflow) | 1987-06-05 | 1987-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987086731U JPS63195745U (enrdf_load_stackoverflow) | 1987-06-05 | 1987-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63195745U true JPS63195745U (enrdf_load_stackoverflow) | 1988-12-16 |
Family
ID=30943312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987086731U Pending JPS63195745U (enrdf_load_stackoverflow) | 1987-06-05 | 1987-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63195745U (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02214158A (ja) * | 1989-02-15 | 1990-08-27 | Mitsubishi Electric Corp | 赤外線イメージセンサ装置 |
-
1987
- 1987-06-05 JP JP1987086731U patent/JPS63195745U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02214158A (ja) * | 1989-02-15 | 1990-08-27 | Mitsubishi Electric Corp | 赤外線イメージセンサ装置 |