JPH02106836U - - Google Patents
Info
- Publication number
- JPH02106836U JPH02106836U JP1989015252U JP1525289U JPH02106836U JP H02106836 U JPH02106836 U JP H02106836U JP 1989015252 U JP1989015252 U JP 1989015252U JP 1525289 U JP1525289 U JP 1525289U JP H02106836 U JPH02106836 U JP H02106836U
- Authority
- JP
- Japan
- Prior art keywords
- fin
- support member
- ceramic base
- heat dissipation
- end surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims 4
- 239000000956 alloy Substances 0.000 claims 3
- 229910000838 Al alloy Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000002131 composite material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989015252U JPH02106836U (enrdf_load_stackoverflow) | 1989-02-10 | 1989-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989015252U JPH02106836U (enrdf_load_stackoverflow) | 1989-02-10 | 1989-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106836U true JPH02106836U (enrdf_load_stackoverflow) | 1990-08-24 |
Family
ID=31227141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989015252U Pending JPH02106836U (enrdf_load_stackoverflow) | 1989-02-10 | 1989-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106836U (enrdf_load_stackoverflow) |
-
1989
- 1989-02-10 JP JP1989015252U patent/JPH02106836U/ja active Pending