JPS62188151U - - Google Patents
Info
- Publication number
- JPS62188151U JPS62188151U JP1986075296U JP7529686U JPS62188151U JP S62188151 U JPS62188151 U JP S62188151U JP 1986075296 U JP1986075296 U JP 1986075296U JP 7529686 U JP7529686 U JP 7529686U JP S62188151 U JPS62188151 U JP S62188151U
- Authority
- JP
- Japan
- Prior art keywords
- silicon carbide
- semiconductor device
- carbide substrate
- joined
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- 229910021426 porous silicon Inorganic materials 0.000 claims description 2
- 238000005219 brazing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986075296U JPS62188151U (enrdf_load_stackoverflow) | 1986-05-21 | 1986-05-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986075296U JPS62188151U (enrdf_load_stackoverflow) | 1986-05-21 | 1986-05-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62188151U true JPS62188151U (enrdf_load_stackoverflow) | 1987-11-30 |
Family
ID=30921302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986075296U Pending JPS62188151U (enrdf_load_stackoverflow) | 1986-05-21 | 1986-05-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62188151U (enrdf_load_stackoverflow) |
-
1986
- 1986-05-21 JP JP1986075296U patent/JPS62188151U/ja active Pending