JPH0244345U - - Google Patents
Info
- Publication number
- JPH0244345U JPH0244345U JP1988122654U JP12265488U JPH0244345U JP H0244345 U JPH0244345 U JP H0244345U JP 1988122654 U JP1988122654 U JP 1988122654U JP 12265488 U JP12265488 U JP 12265488U JP H0244345 U JPH0244345 U JP H0244345U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- cooling
- cooling module
- aln
- ceramics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims 6
- 239000004065 semiconductor Substances 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000004519 grease Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122654U JPH0244345U (enrdf_load_stackoverflow) | 1988-09-21 | 1988-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122654U JPH0244345U (enrdf_load_stackoverflow) | 1988-09-21 | 1988-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0244345U true JPH0244345U (enrdf_load_stackoverflow) | 1990-03-27 |
Family
ID=31370784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988122654U Pending JPH0244345U (enrdf_load_stackoverflow) | 1988-09-21 | 1988-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244345U (enrdf_load_stackoverflow) |
-
1988
- 1988-09-21 JP JP1988122654U patent/JPH0244345U/ja active Pending