JPS58159740U - ワイヤ剥離試験装置 - Google Patents

ワイヤ剥離試験装置

Info

Publication number
JPS58159740U
JPS58159740U JP1982057466U JP5746682U JPS58159740U JP S58159740 U JPS58159740 U JP S58159740U JP 1982057466 U JP1982057466 U JP 1982057466U JP 5746682 U JP5746682 U JP 5746682U JP S58159740 U JPS58159740 U JP S58159740U
Authority
JP
Japan
Prior art keywords
wire
test equipment
peel test
semiconductor device
wire peel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982057466U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451481Y2 (enExample
Inventor
清水　智旦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP1982057466U priority Critical patent/JPS58159740U/ja
Publication of JPS58159740U publication Critical patent/JPS58159740U/ja
Application granted granted Critical
Publication of JPH0451481Y2 publication Critical patent/JPH0451481Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop

Landscapes

  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP1982057466U 1982-04-20 1982-04-20 ワイヤ剥離試験装置 Granted JPS58159740U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982057466U JPS58159740U (ja) 1982-04-20 1982-04-20 ワイヤ剥離試験装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982057466U JPS58159740U (ja) 1982-04-20 1982-04-20 ワイヤ剥離試験装置

Publications (2)

Publication Number Publication Date
JPS58159740U true JPS58159740U (ja) 1983-10-25
JPH0451481Y2 JPH0451481Y2 (enExample) 1992-12-03

Family

ID=30067915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982057466U Granted JPS58159740U (ja) 1982-04-20 1982-04-20 ワイヤ剥離試験装置

Country Status (1)

Country Link
JP (1) JPS58159740U (enExample)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111916A (ja) * 1975-06-02 1976-01-30 Toyo Boseki Bisukoosutenkayonannenzaisoseibutsu
JPS54170103U (enExample) * 1978-05-19 1979-12-01
JPS55108518U (enExample) * 1979-01-19 1980-07-30
JPS565314U (enExample) * 1979-06-27 1981-01-17
JPS56131506U (enExample) * 1980-03-05 1981-10-06
JPS56131505U (enExample) * 1980-03-05 1981-10-06

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111916A (ja) * 1975-06-02 1976-01-30 Toyo Boseki Bisukoosutenkayonannenzaisoseibutsu
JPS54170103U (enExample) * 1978-05-19 1979-12-01
JPS55108518U (enExample) * 1979-01-19 1980-07-30
JPS565314U (enExample) * 1979-06-27 1981-01-17
JPS56131506U (enExample) * 1980-03-05 1981-10-06
JPS56131505U (enExample) * 1980-03-05 1981-10-06

Also Published As

Publication number Publication date
JPH0451481Y2 (enExample) 1992-12-03

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