JPS58159740U - ワイヤ剥離試験装置 - Google Patents

ワイヤ剥離試験装置

Info

Publication number
JPS58159740U
JPS58159740U JP5746682U JP5746682U JPS58159740U JP S58159740 U JPS58159740 U JP S58159740U JP 5746682 U JP5746682 U JP 5746682U JP 5746682 U JP5746682 U JP 5746682U JP S58159740 U JPS58159740 U JP S58159740U
Authority
JP
Japan
Prior art keywords
wire
test equipment
peel test
semiconductor device
wire peel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5746682U
Other languages
English (en)
Other versions
JPH0451481Y2 (ja
Inventor
清水　智旦
Original Assignee
株式会社新川
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社新川 filed Critical 株式会社新川
Priority to JP5746682U priority Critical patent/JPS58159740U/ja
Publication of JPS58159740U publication Critical patent/JPS58159740U/ja
Application granted granted Critical
Publication of JPH0451481Y2 publication Critical patent/JPH0451481Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop

Landscapes

  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す側面図、第２図は第１
図のＡ−Ａ線矢視一部断面平面図、第３図はテンション
ゲージの斜視図、第４図は半導体装置のワイヤ付根に測
針を接触させた状態を示す拡大図である。 １・・・テンションゲージ、２・・・測針、３・・・操
作板、８・・・ギヤ軸、９・・・ベアリング、１６・・
・ベース、１７・・・固定台、２０・・・半導体装置、
２１・・・ペレット、２２・・・パッド、２３・・・ワ
イヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体部品のペレットのパッドと外部リードとの間をワ
    イヤで接続された半導体装置を固定する固定台と、この
    固定台に固定された前記半導体装置のパッド側又はリー
    ド側のワイヤ側面に当接させる測針を有するテンション
    ゲージと、このテンションゲージを前記半導体装置の一
    重部と平行に回動自在に支持する支持機構とを備えたワ
    イヤ剥離試験装置。
JP5746682U 1982-04-20 1982-04-20 ワイヤ剥離試験装置 Granted JPS58159740U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5746682U JPS58159740U (ja) 1982-04-20 1982-04-20 ワイヤ剥離試験装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5746682U JPS58159740U (ja) 1982-04-20 1982-04-20 ワイヤ剥離試験装置

Publications (2)

Publication Number Publication Date
JPS58159740U true JPS58159740U (ja) 1983-10-25
JPH0451481Y2 JPH0451481Y2 (ja) 1992-12-03

Family

ID=30067915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5746682U Granted JPS58159740U (ja) 1982-04-20 1982-04-20 ワイヤ剥離試験装置

Country Status (1)

Country Link
JP (1) JPS58159740U (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111916A (ja) * 1975-06-02 1976-01-30 Toyo Boseki Bisukoosutenkayonannenzaisoseibutsu
JPS54170103U (ja) * 1978-05-19 1979-12-01
JPS55108518U (ja) * 1979-01-19 1980-07-30
JPS565314U (ja) * 1979-06-27 1981-01-17
JPS56131506U (ja) * 1980-03-05 1981-10-06
JPS56131505U (ja) * 1980-03-05 1981-10-06

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111916A (ja) * 1975-06-02 1976-01-30 Toyo Boseki Bisukoosutenkayonannenzaisoseibutsu
JPS54170103U (ja) * 1978-05-19 1979-12-01
JPS55108518U (ja) * 1979-01-19 1980-07-30
JPS565314U (ja) * 1979-06-27 1981-01-17
JPS56131506U (ja) * 1980-03-05 1981-10-06
JPS56131505U (ja) * 1980-03-05 1981-10-06

Also Published As

Publication number Publication date
JPH0451481Y2 (ja) 1992-12-03

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