JPS58154250A - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS58154250A
JPS58154250A JP3744482A JP3744482A JPS58154250A JP S58154250 A JPS58154250 A JP S58154250A JP 3744482 A JP3744482 A JP 3744482A JP 3744482 A JP3744482 A JP 3744482A JP S58154250 A JPS58154250 A JP S58154250A
Authority
JP
Japan
Prior art keywords
substrate
hybrid integrated
integrated circuit
fixing piece
packing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3744482A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0354469B2 (enrdf_load_stackoverflow
Inventor
Yoshio Miura
三浦　敬男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP3744482A priority Critical patent/JPS58154250A/ja
Publication of JPS58154250A publication Critical patent/JPS58154250A/ja
Publication of JPH0354469B2 publication Critical patent/JPH0354469B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
JP3744482A 1982-03-09 1982-03-09 混成集積回路 Granted JPS58154250A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3744482A JPS58154250A (ja) 1982-03-09 1982-03-09 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3744482A JPS58154250A (ja) 1982-03-09 1982-03-09 混成集積回路

Publications (2)

Publication Number Publication Date
JPS58154250A true JPS58154250A (ja) 1983-09-13
JPH0354469B2 JPH0354469B2 (enrdf_load_stackoverflow) 1991-08-20

Family

ID=12497670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3744482A Granted JPS58154250A (ja) 1982-03-09 1982-03-09 混成集積回路

Country Status (1)

Country Link
JP (1) JPS58154250A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008019087A (ja) * 2006-07-14 2008-01-31 Mitsubishi Heavy Ind Ltd ウェブ折り畳み装置及び輪転印刷機
FR2957192A1 (fr) * 2010-03-03 2011-09-09 Hispano Suiza Sa Module electronique de puissance pour un actionneur pour aeronef
CN102915976A (zh) * 2012-10-08 2013-02-06 华东光电集成器件研究所 一种耐高过载的集成电路

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008019087A (ja) * 2006-07-14 2008-01-31 Mitsubishi Heavy Ind Ltd ウェブ折り畳み装置及び輪転印刷機
FR2957192A1 (fr) * 2010-03-03 2011-09-09 Hispano Suiza Sa Module electronique de puissance pour un actionneur pour aeronef
CN102915976A (zh) * 2012-10-08 2013-02-06 华东光电集成器件研究所 一种耐高过载的集成电路

Also Published As

Publication number Publication date
JPH0354469B2 (enrdf_load_stackoverflow) 1991-08-20

Similar Documents

Publication Publication Date Title
US4079511A (en) Method for packaging hermetically sealed integrated circuit chips on lead frames
TW360958B (en) Resin sealing type semiconductor device and manufacturing method thereof
KR930024140A (ko) 반도체장치 및 그 제조방법
US4482781A (en) Stabilization of semiconductor device package leads
US5445995A (en) Method for manufacturing plastic-encapsulated semiconductor devices with exposed metal heat sink
JPS58154250A (ja) 混成集積回路
JPS63187652A (ja) 耐熱性樹脂封止半導体装置
JP3064850B2 (ja) 半導体装置用リードフレーム
JPH06334070A (ja) 混成集積回路装置
JPS63117451A (ja) 半導体装置
JP3693450B2 (ja) 固体イメージセンサ装置
JP2739349B2 (ja) 電子部品搭載用基板
JPS58153354A (ja) 混成集積回路
JPH0691162B2 (ja) 電子部品封止用キヤツプとその製造方法
JPH02102565A (ja) 半導体装置
JPS63248155A (ja) 半導体装置
JP2507273Y2 (ja) 樹脂封止型電子機器
JPS5918450U (ja) 太陽電池モジユ−ル
JPS5812447Y2 (ja) 半導体装置
JPH03129840A (ja) 樹脂封止型半導体装置
JPH04115540A (ja) 放熱板付き半導体装置の製造方法
JPS5710253A (en) Semiconductor device
JP3552301B2 (ja) 電子部品搭載用基板及びその製造方法
JPH0613499A (ja) 混成集積回路装置
JPS5824463Y2 (ja) 混成集積回路のパッケ−ジ構造