JPS58147248U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58147248U
JPS58147248U JP1982044487U JP4448782U JPS58147248U JP S58147248 U JPS58147248 U JP S58147248U JP 1982044487 U JP1982044487 U JP 1982044487U JP 4448782 U JP4448782 U JP 4448782U JP S58147248 U JPS58147248 U JP S58147248U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor
pellet
semiconductor pellet
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982044487U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0119397Y2 (enFirst
Inventor
▲あま▼田　秀雄
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1982044487U priority Critical patent/JPS58147248U/ja
Publication of JPS58147248U publication Critical patent/JPS58147248U/ja
Application granted granted Critical
Publication of JPH0119397Y2 publication Critical patent/JPH0119397Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1982044487U 1982-03-29 1982-03-29 半導体装置 Granted JPS58147248U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982044487U JPS58147248U (ja) 1982-03-29 1982-03-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982044487U JPS58147248U (ja) 1982-03-29 1982-03-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS58147248U true JPS58147248U (ja) 1983-10-03
JPH0119397Y2 JPH0119397Y2 (enFirst) 1989-06-05

Family

ID=30055543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982044487U Granted JPS58147248U (ja) 1982-03-29 1982-03-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS58147248U (enFirst)

Also Published As

Publication number Publication date
JPH0119397Y2 (enFirst) 1989-06-05

Similar Documents

Publication Publication Date Title
JPS58147248U (ja) 半導体装置
JPS61240U (ja) 半導体装置
JPS58150838U (ja) 半導体装置
JPS58148931U (ja) 半導体装置
JPS59145047U (ja) 半導体装置
JPS6088560U (ja) 半導体装置
JPS6142861U (ja) 半導体装置
JPS5937747U (ja) 半導体装置
JPS60181050U (ja) 半導体装置
JPS5989551U (ja) 半導体集積回路装置
JPS59112955U (ja) 半導体素子
JPS58135963U (ja) 半導体装置
JPS58144848U (ja) ハイブリツドｉｃ
JPS5954956U (ja) 半導体パツケ−ジ
JPS5911449U (ja) 半導体装置
JPS5853160U (ja) 非晶質半導体装置
JPS58131632U (ja) 半導体装置
JPS6094836U (ja) 半導体装置
JPS5899841U (ja) 半導体装置
JPS5996851U (ja) 半導体装置
JPS60101755U (ja) 半導体装置
JPS6130250U (ja) 半導体装置
JPS60163744U (ja) 半導体集積回路装置
JPS5916138U (ja) 半導体装置
JPS6030539U (ja) 半導体装置