JPS58143A - 超音波ワイヤボンデイング方法 - Google Patents

超音波ワイヤボンデイング方法

Info

Publication number
JPS58143A
JPS58143A JP56098711A JP9871181A JPS58143A JP S58143 A JPS58143 A JP S58143A JP 56098711 A JP56098711 A JP 56098711A JP 9871181 A JP9871181 A JP 9871181A JP S58143 A JPS58143 A JP S58143A
Authority
JP
Japan
Prior art keywords
wire
wedge
bond
point
clamper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56098711A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6233742B2 (cg-RX-API-DMAC10.html
Inventor
Yoshimitsu Terakado
義光 寺門
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56098711A priority Critical patent/JPS58143A/ja
Publication of JPS58143A publication Critical patent/JPS58143A/ja
Publication of JPS6233742B2 publication Critical patent/JPS6233742B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/07533—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/59—
    • H10W72/932—

Landscapes

  • Wire Bonding (AREA)
JP56098711A 1981-06-25 1981-06-25 超音波ワイヤボンデイング方法 Granted JPS58143A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56098711A JPS58143A (ja) 1981-06-25 1981-06-25 超音波ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56098711A JPS58143A (ja) 1981-06-25 1981-06-25 超音波ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS58143A true JPS58143A (ja) 1983-01-05
JPS6233742B2 JPS6233742B2 (cg-RX-API-DMAC10.html) 1987-07-22

Family

ID=14227092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56098711A Granted JPS58143A (ja) 1981-06-25 1981-06-25 超音波ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS58143A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023128947A (ja) * 2022-03-04 2023-09-14 日清紡マイクロデバイス株式会社 半導体装置およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5489958A (en) * 1977-12-27 1979-07-17 Toshiba Corp Wire bonding apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5489958A (en) * 1977-12-27 1979-07-17 Toshiba Corp Wire bonding apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023128947A (ja) * 2022-03-04 2023-09-14 日清紡マイクロデバイス株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPS6233742B2 (cg-RX-API-DMAC10.html) 1987-07-22

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