JPS58131735A - タンタルオキサイド膜の製造法 - Google Patents

タンタルオキサイド膜の製造法

Info

Publication number
JPS58131735A
JPS58131735A JP57013005A JP1300582A JPS58131735A JP S58131735 A JPS58131735 A JP S58131735A JP 57013005 A JP57013005 A JP 57013005A JP 1300582 A JP1300582 A JP 1300582A JP S58131735 A JPS58131735 A JP S58131735A
Authority
JP
Japan
Prior art keywords
film
tantalum
oxide film
irradiated
tantalum oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57013005A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6364895B2 (enrdf_load_stackoverflow
Inventor
Junji Sakurai
桜井 潤治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57013005A priority Critical patent/JPS58131735A/ja
Publication of JPS58131735A publication Critical patent/JPS58131735A/ja
Publication of JPS6364895B2 publication Critical patent/JPS6364895B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02244Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of a metallic layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Formation Of Insulating Films (AREA)
JP57013005A 1982-01-29 1982-01-29 タンタルオキサイド膜の製造法 Granted JPS58131735A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57013005A JPS58131735A (ja) 1982-01-29 1982-01-29 タンタルオキサイド膜の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57013005A JPS58131735A (ja) 1982-01-29 1982-01-29 タンタルオキサイド膜の製造法

Publications (2)

Publication Number Publication Date
JPS58131735A true JPS58131735A (ja) 1983-08-05
JPS6364895B2 JPS6364895B2 (enrdf_load_stackoverflow) 1988-12-14

Family

ID=11821057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57013005A Granted JPS58131735A (ja) 1982-01-29 1982-01-29 タンタルオキサイド膜の製造法

Country Status (1)

Country Link
JP (1) JPS58131735A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246756A (ja) * 1988-08-08 1990-02-16 Mitsubishi Electric Corp 半導体容量素子の製造方法
JPH06244364A (ja) * 1993-02-17 1994-09-02 Nec Corp 半導体装置の製造方法
KR20020058427A (ko) * 2000-12-30 2002-07-12 박종섭 커패시터의 제조방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246756A (ja) * 1988-08-08 1990-02-16 Mitsubishi Electric Corp 半導体容量素子の製造方法
JPH06244364A (ja) * 1993-02-17 1994-09-02 Nec Corp 半導体装置の製造方法
KR20020058427A (ko) * 2000-12-30 2002-07-12 박종섭 커패시터의 제조방법

Also Published As

Publication number Publication date
JPS6364895B2 (enrdf_load_stackoverflow) 1988-12-14

Similar Documents

Publication Publication Date Title
US6118146A (en) Microelectronic capacitors having tantalum pentoxide dielectrics
KR100276844B1 (ko) 메모리장치용고유전성이산화티탄-질화규소복합필름
US4959745A (en) Capacitor and method for producing the same
JPH0869998A (ja) 低温オゾン・プラズマ・アニールによる酸化タンタル薄膜製造方法
US6953722B2 (en) Method for patterning ceramic layers
US5444006A (en) Method of manufacturing a capacitor in a semiconductor memory device
KR920007106A (ko) 고체전자소자 및 그의 제조방법
JPS63502470A (ja) 誘電体薄層を有する装置の製造方法
US4406053A (en) Process for manufacturing a semiconductor device having a non-porous passivation layer
JPS58131735A (ja) タンタルオキサイド膜の製造法
FR2620571A1 (fr) Procede de fabrication d'une structure de silicium sur isolant
JP3179779B2 (ja) 窒化物絶縁膜の作製方法
JPH0367346B2 (enrdf_load_stackoverflow)
JPS60107838A (ja) 半導体装置の製造方法
JP3337506B2 (ja) 電解コンデンサ電極用アルミニウム材料の製造方法
KR950008796B1 (ko) 캐패시터 제조방법
JPH05343254A (ja) 容量装置およびその製造方法
US6664171B2 (en) Method of alloying a semiconductor device
JPH06291255A (ja) 半導体装置及びその製造方法
US6379986B1 (en) Method of forming tunnel oxide film for superconducting X-ray sensor element
JPH04192556A (ja) 半導体装置の製造方法
KR100275389B1 (ko) 메모리 장치용 고유전성 이산화티탄-질화규소 복합 필름
JPH06136495A (ja) 電解コンデンサ電極用アルミニウム材料の製造方法
JPS58112360A (ja) 半導体装置用キヤパシタおよびその製造方法
JP3128925B2 (ja) 半導体集積回路用容量素子の製造方法