JPS58130548A - 半導体用リ−ドピンの製造方法 - Google Patents
半導体用リ−ドピンの製造方法Info
- Publication number
- JPS58130548A JPS58130548A JP1270082A JP1270082A JPS58130548A JP S58130548 A JPS58130548 A JP S58130548A JP 1270082 A JP1270082 A JP 1270082A JP 1270082 A JP1270082 A JP 1270082A JP S58130548 A JPS58130548 A JP S58130548A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- brazing
- plate material
- bin
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1270082A JPS58130548A (ja) | 1982-01-29 | 1982-01-29 | 半導体用リ−ドピンの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1270082A JPS58130548A (ja) | 1982-01-29 | 1982-01-29 | 半導体用リ−ドピンの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58130548A true JPS58130548A (ja) | 1983-08-04 |
| JPH0141033B2 JPH0141033B2 (enrdf_load_stackoverflow) | 1989-09-01 |
Family
ID=11812662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1270082A Granted JPS58130548A (ja) | 1982-01-29 | 1982-01-29 | 半導体用リ−ドピンの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58130548A (enrdf_load_stackoverflow) |
-
1982
- 1982-01-29 JP JP1270082A patent/JPS58130548A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0141033B2 (enrdf_load_stackoverflow) | 1989-09-01 |
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