JPS58130548A - 半導体用リ−ドピンの製造方法 - Google Patents

半導体用リ−ドピンの製造方法

Info

Publication number
JPS58130548A
JPS58130548A JP57012700A JP1270082A JPS58130548A JP S58130548 A JPS58130548 A JP S58130548A JP 57012700 A JP57012700 A JP 57012700A JP 1270082 A JP1270082 A JP 1270082A JP S58130548 A JPS58130548 A JP S58130548A
Authority
JP
Japan
Prior art keywords
lead
brazing
plate material
bin
lead bin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57012700A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0141033B2 (cg-RX-API-DMAC10.html
Inventor
Hitoshi Tsuji
斉 辻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP57012700A priority Critical patent/JPS58130548A/ja
Publication of JPS58130548A publication Critical patent/JPS58130548A/ja
Publication of JPH0141033B2 publication Critical patent/JPH0141033B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57012700A 1982-01-29 1982-01-29 半導体用リ−ドピンの製造方法 Granted JPS58130548A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57012700A JPS58130548A (ja) 1982-01-29 1982-01-29 半導体用リ−ドピンの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57012700A JPS58130548A (ja) 1982-01-29 1982-01-29 半導体用リ−ドピンの製造方法

Publications (2)

Publication Number Publication Date
JPS58130548A true JPS58130548A (ja) 1983-08-04
JPH0141033B2 JPH0141033B2 (cg-RX-API-DMAC10.html) 1989-09-01

Family

ID=11812662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57012700A Granted JPS58130548A (ja) 1982-01-29 1982-01-29 半導体用リ−ドピンの製造方法

Country Status (1)

Country Link
JP (1) JPS58130548A (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPH0141033B2 (cg-RX-API-DMAC10.html) 1989-09-01

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