JPH0141033B2 - - Google Patents

Info

Publication number
JPH0141033B2
JPH0141033B2 JP57012700A JP1270082A JPH0141033B2 JP H0141033 B2 JPH0141033 B2 JP H0141033B2 JP 57012700 A JP57012700 A JP 57012700A JP 1270082 A JP1270082 A JP 1270082A JP H0141033 B2 JPH0141033 B2 JP H0141033B2
Authority
JP
Japan
Prior art keywords
brazing
lead pins
lead
lead pin
plate material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57012700A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58130548A (ja
Inventor
Hitoshi Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP57012700A priority Critical patent/JPS58130548A/ja
Publication of JPS58130548A publication Critical patent/JPS58130548A/ja
Publication of JPH0141033B2 publication Critical patent/JPH0141033B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57012700A 1982-01-29 1982-01-29 半導体用リ−ドピンの製造方法 Granted JPS58130548A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57012700A JPS58130548A (ja) 1982-01-29 1982-01-29 半導体用リ−ドピンの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57012700A JPS58130548A (ja) 1982-01-29 1982-01-29 半導体用リ−ドピンの製造方法

Publications (2)

Publication Number Publication Date
JPS58130548A JPS58130548A (ja) 1983-08-04
JPH0141033B2 true JPH0141033B2 (cg-RX-API-DMAC10.html) 1989-09-01

Family

ID=11812662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57012700A Granted JPS58130548A (ja) 1982-01-29 1982-01-29 半導体用リ−ドピンの製造方法

Country Status (1)

Country Link
JP (1) JPS58130548A (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPS58130548A (ja) 1983-08-04

Similar Documents

Publication Publication Date Title
JPH0141033B2 (cg-RX-API-DMAC10.html)
JP3051598B2 (ja) Ａｇろう付きシールリング及びその製造方法
JPS60113449A (ja) 難加工性ろう材付リ−ドピンの製造方法
JP2670098B2 (ja) ろう付きリードフレーム
CN110573286A (zh) 钎焊钉头引线
JPH0350639B2 (cg-RX-API-DMAC10.html)
JP2549996B2 (ja) リードフレームおよびこれを用いた集積回路パッケージの製造方法
JPS63104355A (ja) Ｉｃセラミツクパツケ−ジのシ−ルリングおよびその製造方法
JPS59118269A (ja) ピンろう接方法
JP2582818B2 (ja) リベット型複合電気接点の製造方法
JPH01309360A (ja) 銀ろう付リードピンの製造方法
JPH0642349Y2 (ja) 集積回路用複合ピンの製造用カーボン製治具
JPH0467340B2 (cg-RX-API-DMAC10.html)
JP2648033B2 (ja) 電子部品フレーム接合方法
JPS6351543B2 (cg-RX-API-DMAC10.html)
JPH0463467A (ja) 半導体装置用リードピンとその製造方法
JPH09102686A (ja) ピンフィン型ヒートシンクの製造方法
JPS58165219A (ja) 複合電気接点材の製造方法
JPS6354760A (ja) ピン・グリツド・アレイ用ピンの製造方法
JPS58184750A (ja) 半導体用リ−ドピン
JPH02858B2 (cg-RX-API-DMAC10.html)
JPH05251614A (ja) ろう材振り込み治具
JPH01318255A (ja) ろう付きリードフレームの製造方法
JPS61240529A (ja) マグネトロン用陰極構体の製造方法
JPH0555406A (ja) セラミツクパツケージの製造方法