JPS58128847A - エポキシ樹脂銅張積層板 - Google Patents

エポキシ樹脂銅張積層板

Info

Publication number
JPS58128847A
JPS58128847A JP1197982A JP1197982A JPS58128847A JP S58128847 A JPS58128847 A JP S58128847A JP 1197982 A JP1197982 A JP 1197982A JP 1197982 A JP1197982 A JP 1197982A JP S58128847 A JPS58128847 A JP S58128847A
Authority
JP
Japan
Prior art keywords
epoxy
steel
laminated board
laminate
resin copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1197982A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0226580B2 (enrdf_load_stackoverflow
Inventor
藤岡　厚
康夫 宮寺
富男 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP1197982A priority Critical patent/JPS58128847A/ja
Publication of JPS58128847A publication Critical patent/JPS58128847A/ja
Publication of JPH0226580B2 publication Critical patent/JPH0226580B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP1197982A 1982-01-27 1982-01-27 エポキシ樹脂銅張積層板 Granted JPS58128847A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1197982A JPS58128847A (ja) 1982-01-27 1982-01-27 エポキシ樹脂銅張積層板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1197982A JPS58128847A (ja) 1982-01-27 1982-01-27 エポキシ樹脂銅張積層板

Publications (2)

Publication Number Publication Date
JPS58128847A true JPS58128847A (ja) 1983-08-01
JPH0226580B2 JPH0226580B2 (enrdf_load_stackoverflow) 1990-06-11

Family

ID=11792715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1197982A Granted JPS58128847A (ja) 1982-01-27 1982-01-27 エポキシ樹脂銅張積層板

Country Status (1)

Country Link
JP (1) JPS58128847A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61262120A (ja) * 1985-05-16 1986-11-20 東洋紡績株式会社 芳香族ポリアミド不織布補強樹脂シ−ト

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61262120A (ja) * 1985-05-16 1986-11-20 東洋紡績株式会社 芳香族ポリアミド不織布補強樹脂シ−ト

Also Published As

Publication number Publication date
JPH0226580B2 (enrdf_load_stackoverflow) 1990-06-11

Similar Documents

Publication Publication Date Title
US5945222A (en) Thermosetting resin composition, cured product, prepreg, metal-clad laminate and wiring board
JP3412585B2 (ja) プリント配線板及び多層プリント配線板の製造に用いられるプリプレグ用エポキシ樹脂組成物、プリプレグ、多層プリント配線板
JP4770019B2 (ja) プリプレグ及び金属箔張り積層板
JPS58128847A (ja) エポキシ樹脂銅張積層板
JPH0722718A (ja) 印刷配線板用エポキシ樹脂組成物、印刷配線板用プリプレグの製造方法及びコンポジット積層板の製造方法
CN102838842A (zh) 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板
JP3883273B2 (ja) エポキシ樹脂組成物含浸シート
US5043368A (en) Polyetherimide/epoxy chopped fiber reinforced laminates and the preparation thereof
JPH0226579B2 (enrdf_load_stackoverflow)
JPH05318653A (ja) 難燃性銅張積層板の製造方法
JP3373164B2 (ja) プリプレグ及び積層板の製造方法
JP3344228B2 (ja) 積層板用エポキシ樹脂組成物
JP2008050566A (ja) 樹脂組成物、プリプレグ及び該プリプレグを用いた金属張積層板
JPH08325395A (ja) エポキシ樹脂組成物含浸シート
JPH0371460B2 (enrdf_load_stackoverflow)
JPS62207322A (ja) 熱硬化性樹脂組成物
JP3009947B2 (ja) エポキシ樹脂組成物
JPH10251380A (ja) 熱硬化性樹脂組成物
JP6323706B2 (ja) 熱硬化性樹脂組成物ワニスの製造方法及び、それを用いたプリプレグ、積層板、配線板の製造方法
JPS643224B2 (enrdf_load_stackoverflow)
JPS61199947A (ja) 印刷配線板用銅張り積層板の製造法
JP2004059704A (ja) プリント配線板用エポキシ樹脂組成物、プリプレグ及び積層板
JPS63297420A (ja) 層間絶縁樹脂組成物
JPH0369372B2 (enrdf_load_stackoverflow)
JPH09141781A (ja) 印刷回路用積層板の製造方法