JPS58119657A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS58119657A
JPS58119657A JP57000862A JP86282A JPS58119657A JP S58119657 A JPS58119657 A JP S58119657A JP 57000862 A JP57000862 A JP 57000862A JP 86282 A JP86282 A JP 86282A JP S58119657 A JPS58119657 A JP S58119657A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
epoxy
epoxy resin
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57000862A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0319707B2 (enExample
Inventor
Hirotoshi Iketani
池谷　裕俊
Akiko Hatanaka
畑中　章子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP57000862A priority Critical patent/JPS58119657A/ja
Publication of JPS58119657A publication Critical patent/JPS58119657A/ja
Publication of JPH0319707B2 publication Critical patent/JPH0319707B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/47—

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57000862A 1982-01-08 1982-01-08 樹脂封止型半導体装置 Granted JPS58119657A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57000862A JPS58119657A (ja) 1982-01-08 1982-01-08 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57000862A JPS58119657A (ja) 1982-01-08 1982-01-08 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS58119657A true JPS58119657A (ja) 1983-07-16
JPH0319707B2 JPH0319707B2 (enExample) 1991-03-15

Family

ID=11485472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57000862A Granted JPS58119657A (ja) 1982-01-08 1982-01-08 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS58119657A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018521A (ja) * 1983-07-09 1985-01-30 Matsushita Electric Works Ltd エポキシ樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018521A (ja) * 1983-07-09 1985-01-30 Matsushita Electric Works Ltd エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPH0319707B2 (enExample) 1991-03-15

Similar Documents

Publication Publication Date Title
JPH0445982B2 (enExample)
KR900000376B1 (ko) 반도체 봉합용 에폭시수지조성물과 그것을 이용한 수지봉합형 반도체장치
US4572853A (en) Resin encapsulation type semiconductor device
JPS6181426A (ja) 半導体封止用エポキシ樹脂組成物
JPS6219066B2 (enExample)
JPS583382B2 (ja) 樹脂封止型半導体装置
JPS6137788B2 (enExample)
JPS58119657A (ja) 樹脂封止型半導体装置
JPH0379370B2 (enExample)
JP2000309685A (ja) 封止用樹脂組成物および半導体封止装置
JPS58119655A (ja) 樹脂封止型半導体装置
JPS6054458A (ja) 樹脂封止型半導体装置
JPS5956748A (ja) 樹脂封止型半導体装置の
JPS6219070B2 (enExample)
JPS5882544A (ja) 樹脂封止型半導体装置
JPH0549696B2 (enExample)
JP2654376B2 (ja) 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
JPS5895847A (ja) 樹脂封止型半導体装置
JPS5882545A (ja) 樹脂封止型半導体装置
JPS58119654A (ja) 樹脂封止型半導体装置
JPS5895846A (ja) 樹脂封止型半導体装置
JPS6219069B2 (enExample)
JPS5882547A (ja) 樹脂封止型半導体装置
JPS5882548A (ja) 樹脂封止型半導体装置
JPS5896755A (ja) 樹脂封止型半導体装置