JPS6219070B2 - - Google Patents

Info

Publication number
JPS6219070B2
JPS6219070B2 JP56172925A JP17292581A JPS6219070B2 JP S6219070 B2 JPS6219070 B2 JP S6219070B2 JP 56172925 A JP56172925 A JP 56172925A JP 17292581 A JP17292581 A JP 17292581A JP S6219070 B2 JPS6219070 B2 JP S6219070B2
Authority
JP
Japan
Prior art keywords
resin
epoxy resin
acid ester
boric acid
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56172925A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5875857A (ja
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56172925A priority Critical patent/JPS5875857A/ja
Publication of JPS5875857A publication Critical patent/JPS5875857A/ja
Publication of JPS6219070B2 publication Critical patent/JPS6219070B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/47—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP56172925A 1981-10-30 1981-10-30 樹脂封止型半導体装置 Granted JPS5875857A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56172925A JPS5875857A (ja) 1981-10-30 1981-10-30 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56172925A JPS5875857A (ja) 1981-10-30 1981-10-30 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS5875857A JPS5875857A (ja) 1983-05-07
JPS6219070B2 true JPS6219070B2 (enExample) 1987-04-25

Family

ID=15950890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56172925A Granted JPS5875857A (ja) 1981-10-30 1981-10-30 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS5875857A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2574434B2 (ja) * 1988-11-14 1997-01-22 日東電工株式会社 半導体装置
US5378928A (en) * 1993-04-27 1995-01-03 Motorola, Inc. Plastic encapsulated microelectronic device and method
JP3308397B2 (ja) * 1994-07-07 2002-07-29 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物
CN109679045B (zh) * 2018-12-27 2022-04-12 山东圣泉新材料股份有限公司 一种轮胎橡胶用新型绿色补强树脂及其组合物

Also Published As

Publication number Publication date
JPS5875857A (ja) 1983-05-07

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