JPS5811736B2 - ハンドウタイソウチ - Google Patents

ハンドウタイソウチ

Info

Publication number
JPS5811736B2
JPS5811736B2 JP49119025A JP11902574A JPS5811736B2 JP S5811736 B2 JPS5811736 B2 JP S5811736B2 JP 49119025 A JP49119025 A JP 49119025A JP 11902574 A JP11902574 A JP 11902574A JP S5811736 B2 JPS5811736 B2 JP S5811736B2
Authority
JP
Japan
Prior art keywords
semiconductor element
island
semiconductor
hole
souchi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49119025A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5144871A (cg-RX-API-DMAC10.html
Inventor
萩本英二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP49119025A priority Critical patent/JPS5811736B2/ja
Publication of JPS5144871A publication Critical patent/JPS5144871A/ja
Publication of JPS5811736B2 publication Critical patent/JPS5811736B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W90/754—

Landscapes

  • Die Bonding (AREA)
JP49119025A 1974-10-15 1974-10-15 ハンドウタイソウチ Expired JPS5811736B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49119025A JPS5811736B2 (ja) 1974-10-15 1974-10-15 ハンドウタイソウチ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49119025A JPS5811736B2 (ja) 1974-10-15 1974-10-15 ハンドウタイソウチ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP57070139A Division JPS606090B2 (ja) 1982-04-26 1982-04-26 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5144871A JPS5144871A (cg-RX-API-DMAC10.html) 1976-04-16
JPS5811736B2 true JPS5811736B2 (ja) 1983-03-04

Family

ID=14751110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49119025A Expired JPS5811736B2 (ja) 1974-10-15 1974-10-15 ハンドウタイソウチ

Country Status (1)

Country Link
JP (1) JPS5811736B2 (cg-RX-API-DMAC10.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5776848A (en) * 1980-10-30 1982-05-14 Seiko Epson Corp Mounting method for integrated circuit chip
JPS606090B2 (ja) * 1982-04-26 1985-02-15 日本電気株式会社 半導体装置の製造方法
JPS5982746A (ja) * 1982-11-04 1984-05-12 Toshiba Corp 半導体装置の電極配線方法
JPS59141292A (ja) * 1983-02-01 1984-08-13 イビデン株式会社 プリント配線用積層板の製造方法
US4528216A (en) * 1983-02-24 1985-07-09 Oki Electric Industry Co., Ltd. Process for forming heat-resistant resin films of polyimide and organosilicic reactants
JP4025806B2 (ja) 2004-06-22 2007-12-26 伸▲よし▼ 杉谷 歯車機構、遊星歯車装置、および回転軸受装置並びに不思議遊星歯車減速装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918590U (cg-RX-API-DMAC10.html) * 1972-05-19 1974-02-16

Also Published As

Publication number Publication date
JPS5144871A (cg-RX-API-DMAC10.html) 1976-04-16

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