JPS58116755A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58116755A
JPS58116755A JP57138340A JP13834082A JPS58116755A JP S58116755 A JPS58116755 A JP S58116755A JP 57138340 A JP57138340 A JP 57138340A JP 13834082 A JP13834082 A JP 13834082A JP S58116755 A JPS58116755 A JP S58116755A
Authority
JP
Japan
Prior art keywords
resin
film
polyimide
semiconductor substrate
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57138340A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6216022B2 (cg-RX-API-DMAC10.html
Inventor
Kiichiro Mukai
向　喜一郎
Atsushi Saiki
斉木　篤
Yukiyoshi Harada
原田　征喜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57138340A priority Critical patent/JPS58116755A/ja
Publication of JPS58116755A publication Critical patent/JPS58116755A/ja
Publication of JPS6216022B2 publication Critical patent/JPS6216022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/019—
    • H10W42/25—
    • H10W70/60—
    • H10W70/682—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/59—
    • H10W72/701—
    • H10W72/932—
    • H10W72/934—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Formation Of Insulating Films (AREA)
JP57138340A 1982-08-09 1982-08-09 半導体装置 Granted JPS58116755A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57138340A JPS58116755A (ja) 1982-08-09 1982-08-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57138340A JPS58116755A (ja) 1982-08-09 1982-08-09 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP14237578A Division JPS5568659A (en) 1978-11-20 1978-11-20 Semiconductor device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPS58116755A true JPS58116755A (ja) 1983-07-12
JPS6216022B2 JPS6216022B2 (cg-RX-API-DMAC10.html) 1987-04-10

Family

ID=15219623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57138340A Granted JPS58116755A (ja) 1982-08-09 1982-08-09 半導体装置

Country Status (1)

Country Link
JP (1) JPS58116755A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0230131A (ja) * 1988-07-19 1990-01-31 Seiko Epson Corp 半導体装置
EP2240961A1 (en) * 2008-01-09 2010-10-20 Toyota Jidosha Kabushiki Kaisha Semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4645398B2 (ja) * 2005-10-04 2011-03-09 株式会社デンソー 半導体装置およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643614A (en) * 1979-09-17 1981-04-22 Nippon Telegr & Teleph Corp <Ntt> Production of plug for optical fiber connector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643614A (en) * 1979-09-17 1981-04-22 Nippon Telegr & Teleph Corp <Ntt> Production of plug for optical fiber connector

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0230131A (ja) * 1988-07-19 1990-01-31 Seiko Epson Corp 半導体装置
EP2240961A1 (en) * 2008-01-09 2010-10-20 Toyota Jidosha Kabushiki Kaisha Semiconductor device

Also Published As

Publication number Publication date
JPS6216022B2 (cg-RX-API-DMAC10.html) 1987-04-10

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