JPS58111348A - 電子部品 - Google Patents

電子部品

Info

Publication number
JPS58111348A
JPS58111348A JP20925581A JP20925581A JPS58111348A JP S58111348 A JPS58111348 A JP S58111348A JP 20925581 A JP20925581 A JP 20925581A JP 20925581 A JP20925581 A JP 20925581A JP S58111348 A JPS58111348 A JP S58111348A
Authority
JP
Japan
Prior art keywords
sleeve
header
lead wire
electrode
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20925581A
Other languages
English (en)
Japanese (ja)
Other versions
JPH036662B2 (enrdf_load_stackoverflow
Inventor
Toshinao Saito
斉藤 敏直
Kohei Yamada
耕平 山田
Hajime Terakado
寺門 肇
Yasuhiko Ikeda
池田 泰彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP20925581A priority Critical patent/JPS58111348A/ja
Publication of JPS58111348A publication Critical patent/JPS58111348A/ja
Publication of JPH036662B2 publication Critical patent/JPH036662B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Details Of Resistors (AREA)
JP20925581A 1981-12-25 1981-12-25 電子部品 Granted JPS58111348A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20925581A JPS58111348A (ja) 1981-12-25 1981-12-25 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20925581A JPS58111348A (ja) 1981-12-25 1981-12-25 電子部品

Publications (2)

Publication Number Publication Date
JPS58111348A true JPS58111348A (ja) 1983-07-02
JPH036662B2 JPH036662B2 (enrdf_load_stackoverflow) 1991-01-30

Family

ID=16569922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20925581A Granted JPS58111348A (ja) 1981-12-25 1981-12-25 電子部品

Country Status (1)

Country Link
JP (1) JPS58111348A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01185954A (ja) * 1988-01-20 1989-07-25 Nec Corp リードレスダイオード

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01185954A (ja) * 1988-01-20 1989-07-25 Nec Corp リードレスダイオード

Also Published As

Publication number Publication date
JPH036662B2 (enrdf_load_stackoverflow) 1991-01-30

Similar Documents

Publication Publication Date Title
US3125803A (en) Terminals
JPH09148101A (ja) 正特性サーミスタの実装構造
CN110913604B (zh) 半导体装置、半导体装置的制造方法
JPS594008A (ja) 密封したガラスカプセルに入れたセラミツクコンデンサ
JPS58111348A (ja) 電子部品
JP4557804B2 (ja) 半導体装置及びその製造方法
US3534233A (en) Hermetically sealed electrical device
JP4856362B2 (ja) 高電圧セラミックコンデンサ
US2505066A (en) Method of making assemblies of resistor bodies
JPS6214099B2 (enrdf_load_stackoverflow)
JPH1058188A (ja) ろう材及びそれを備えたエンドハット
JP2577315B2 (ja) 口金付管球
JP3325755B2 (ja) 半導体装置及びその実装方法、並びにその実装部の検査方法
JPS59177957A (ja) チツプ実装方法
JPH11204004A (ja) 温度ヒューズ
US4196309A (en) Semiconductor device subassembly and manufacture thereof
JP2591348B2 (ja) 半導体素子の検査治具及び検査方法
JPS6310536A (ja) Ic測定用プロ−ブカ−ド
JP3325804B2 (ja) 半導体装置及びその製造方法
JPH0287030A (ja) 白金温度センサ
JP2938690B2 (ja) 同軸型誘電体共振器
JPH03116670A (ja) 電気ピン
JPH0110934Y2 (enrdf_load_stackoverflow)
JPS6351539B2 (enrdf_load_stackoverflow)
CN117066620A (zh) 硫化锌球罩导电环引线焊接方法