JPH036662B2 - - Google Patents
Info
- Publication number
- JPH036662B2 JPH036662B2 JP20925581A JP20925581A JPH036662B2 JP H036662 B2 JPH036662 B2 JP H036662B2 JP 20925581 A JP20925581 A JP 20925581A JP 20925581 A JP20925581 A JP 20925581A JP H036662 B2 JPH036662 B2 JP H036662B2
- Authority
- JP
- Japan
- Prior art keywords
- sleeve
- lead wire
- header
- electrodes
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Details Of Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20925581A JPS58111348A (ja) | 1981-12-25 | 1981-12-25 | 電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20925581A JPS58111348A (ja) | 1981-12-25 | 1981-12-25 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58111348A JPS58111348A (ja) | 1983-07-02 |
| JPH036662B2 true JPH036662B2 (enrdf_load_stackoverflow) | 1991-01-30 |
Family
ID=16569922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20925581A Granted JPS58111348A (ja) | 1981-12-25 | 1981-12-25 | 電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58111348A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01185954A (ja) * | 1988-01-20 | 1989-07-25 | Nec Corp | リードレスダイオード |
-
1981
- 1981-12-25 JP JP20925581A patent/JPS58111348A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58111348A (ja) | 1983-07-02 |