JPS58108220A - Epoxy resin composition for encapsulation of semiconductor - Google Patents

Abstract

PURPOSE:To prepare the titled resin composition having excellent heat resistance and crack resistance, by mixing a specific amount of rubber to a composition composed of a novolak epoxy resin, a phenolic novolak resin curing agent and powdery silica filler. CONSTITUTION:The objective composition is prepared by adding 0.05-10(wt)%, preferbly 0.1-5% rubber (natural or synthetic rubber having rubber elasticity and preferably having a diameter of 0.5-50mu) to an epoxy resin composition containing, as essential components, a novolak-type epoxy resin as the epoxy resin, a phenolic novolak resin as a curing agent and silica powder as a filler. The amount of the silica powder is 50-80% of the composition.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an epoxy resin composition for semiconductor encapsulation, and more specifically, the epoxy resin is a novolak type epoxy resin, the curing agent is a phenol novolac resin,
An epoxy resin composition for semiconductor encapsulation is prepared by mixing 0.01 to 10% by weight of rubber with an epoxy resin composition containing 10 to 10% by weight of silica powder as an essential component as a filler. 69 heat resistance and excellent crack resistance.

Epoxy resin compositions for semiconductor encapsulation contain a polyfunctional epoxy compound, phenols as a curing agent, silica powder as a filler, and a curing catalyst as essential components in terms of electrical properties, heat resistance, water resistance, etc. This is widely known.

In recent years, semiconductor devices have become larger and more highly integrated, and when semiconductor devices are encapsulated with conventional epoxy resin compositions, cracks occur in the encapsulating resin or even cracks occur after a heat cycle test (1). A problem has arisen in which the reliability of semiconductor components is lowered, such as by the occurrence of. This has been developed from the viewpoint of heat resistance and water resistance.Currently, cured products of epoxy resin compositions for semiconductor encapsulation, such as multifunctional epoxy resins, phenols, and silica, are very fragile and lack flexibility. This is due to the fact that

A method of imparting flexibility to epoxy resins is to add a flexibility imparting agent. For example, Dow Company @ DMR7J, which is known as a regression property imparting agent for epoxy resins.
FipikOte17/ made by t, ah・11
Plastic Material 1j12r111 (7 Hiroshi) Reference] Adding soot improves the flexibility of epoxy resin, but the heat resistance decreases significantly, making it unsuitable as a resin for semiconductor encapsulation that requires a high degree of reliability. .

The present inventors have conducted research on such problems, and the following results are obtained.
An epoxy resin composition which maintains heat resistance and has excellent crack resistance as a semiconductor blocking material has been completed and is a companion to the present invention.

The configuration of the present invention will be explained below.

The novolac type epoxy resin, phenol novolac resin, and silica powder used in the present invention are conventionally known.

The rubber used in the present invention is a natural product and a synthetic product.

Rubber, acrylic comb, urethane comb, silicone rubber, fluororubber, ethylene-propylene rubber, white vinegar rubber, alphine rubber, polyester rubber, natural rubber, imprene rubber, ethylene-butadiene rubber,
Nitrogen rubber, butadiene rubber, etc. may be used, and thermoplastic resins containing rubber components, such as ABC resin, high impact Hollythin resin, etc., may also be added. One or more of these rubbers may be used.

The content of 9 in the rubber composition is 0.01 to 10 II, preferably 0.01 to 10 II. /, 3% is desirable. If the amount of rubber in the composition is less than 0.01%, the crack resistance as a semiconductor sealing material will not be improved, and if it is more than io%, the water resistance will decrease, which is not preferable. In addition, the particle size of the rubber dispersion is 0.
/ -700μ, more preferably O,j~top; if it is less than 0.7μ, crack resistance will not be obtained, and if it is more than 100μ, moldability will deteriorate, which is not preferred.

It is also possible to add a silane coupling agent, a mold release agent, and a pigment-based flame retardant to the epoxy resin composition for semiconductor encapsulation of the present invention as described above, if necessary. Furthermore, bisphenol type and alicyclic epoxy resin can be added to 8i# without reducing heat resistance, water resistance, and moldability.
Curing agents such as acid anhydrides and amines can also be used in combination.

This will be specifically explained below using Examples and Comparative Examples.

V! Hato Case 1 Resol novolak type epoxy resin (product name; [0
After heating and mixing 700 parts of NJJOI (Sumitomo Chemical Co., Ltd.) and 71 parts of styrene-butadiene rubber (trade name: J-NichiR/100. manufactured by Nippon Synthetic Rubber) and dispersing the rubber in the epoxy resin. .

The mixture was cooled and pulverized to obtain a rubber-modified epoxy resin 11).

This resin was mixed in the proportion shown in the other raw materials t-flAI-8, heated and kneaded with a hot roll, and cooled to obtain a sealing material. The amount of rubber in this sealing material was 2.6% by weight, and the average particle size of the rubber was 30μ. A test piece was molded using this material, and further /7j111. J hours of post-cure, yellow color, glass transition temperature 11t
-Measure and then. Also μ0pin process 01l - after molding and post-curing! A heat cycle test was conducted in which the IC was immersed in silicone oil at θ°C for 960 seconds and in 9 m of liquid for 60 seconds to determine the number of cycles until a rack was generated on the surface of the sealing resin of the IC. Furthermore, after post-curing after molding, the test piece was subjected to a +I treatment for 100 hours in a steam pressure cooker at /J/°C and 2 atm, and the volume resistivity was examined before and after this treatment.

These results are shown in 1 with a *.

Styrene-butadiene rubber (product name: JsRizoo,
Mix 3 parts of Nippon Synthetic Rubber with heat and heat. Other raw materials were mixed in the proportions shown in the first rock used to obtain a sealing material having an estimated rubber content of 00j4t% by weight and a rubber average particle size of -20μ. 5j for various exams! The procedure was carried out in the same manner as in Example 1 and the results are shown in Table 1.

Example 3 In place of styrene-butadiene rubber (2) +1 rubber (
11 parts of the product (trade name: 16HJJO8, manufactured by Japan Synthetic Rubber ■) were mixed with 100 parts of Talesol novolak epoxy resin in the same manner as in Example 1 to obtain rubber modified epoxy resin 13:. This was mixed with other raw materials in the proportions shown in Table 1, heated, mixed, and cooled to obtain a sealing material with a rubber content of 2.6 weight and an average rubber particle size/jμ, and the same measurements as in Example 1 were carried out. I did it.

This result is shown in the first sK.

Comparative fIl/, Rubber modified epoxy resin 141.151 was obtained by replacing the addition of 1po, i part and 10 parts of the rubber used for the preparation of the rubber modified epoxy resin in Example 1, and using this stock, tR/H
A test piece was prepared using a sealing material prepared in the same manner as above. Similar tests were conducted using these T and the results are shown in Table 1.

Comparative Example J A flexibility imparting agent for epoxy resin, DFiR7J4 (manufactured by Dot), was mixed at a composition ratio of (!), and the raw materials were heated with a hot roll, mixed, cooled and crushed to obtain a sealing material. A post-molding test session was conducted using this sealing material in the same manner as in Example 1, and the results are shown in Table yR1.

Comparative Example Flexibility imparting agent for epoxy resin Epikote/7/(
A sealing material was prepared in the same manner as in Comparative Example 3 using raw materials mixed at the composition ratios shown in Table 1.

A post-molding test was conducted using this sealing material in the same manner as in Example 1, and the results are shown in Table 1.

Comparative example! Without rubber and flexibilizing agents, Ilm, / *
The sealed material prepared with the composition was molded and tested in the same manner as in Example 1, and the results are shown in Table 1.

Procedural amendment (written voluntarily) 1. Display of the case 1982 Patent Application No. 206483 2 Name of the invention Epoxy resin composition for semiconductor encapsulation λ Person making the amendment Relationship to the case (Patent applicant) Address (100) 2-5 Marunouchi, Chiyoda-ku, Tokyo No. 2 Table No. 2 is corrected in the parentheses below.

Claims (1)

[Claims] Novolac type epoxy resin as epoxy resin Phenol novolac resin as hardener and silica powder as filler in the composition! An epoxy resin composition for semiconductor encapsulation, which is obtained by mixing rubber YrO0OJ-10 by weight with an epoxy resin composition containing O-l"O by weight as an essential component.