JPS58105164U - printed board circuit - Google Patents
printed board circuitInfo
- Publication number
- JPS58105164U JPS58105164U JP147182U JP147182U JPS58105164U JP S58105164 U JPS58105164 U JP S58105164U JP 147182 U JP147182 U JP 147182U JP 147182 U JP147182 U JP 147182U JP S58105164 U JPS58105164 U JP S58105164U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- substrate
- printed board
- circuit pattern
- board circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案によるプリント板回路を適用する回路の
例としてＶＨＦ発振回路を示す回路図、第２図および第
３図は本考案によるプリント根回 −路の裏面を示す平
面図である。
主要部分の符号の説明、１０・・・・・・プリント基板
、１２・・・・・・アースランド、１３・・・・・・ホ
ットランド、２０・・・・・・スリット、２０Ａ、２０
Ｂ、２０Ｃ・・・・・・スリットのセクション、２２・
・・・・・基板の一部分、２４Ａ、２４Ｂ、２４Ｃ・・
・・・・支持部。FIG. 1 is a circuit diagram showing a VHF oscillation circuit as an example of a circuit to which the printed board circuit according to the present invention is applied, and FIGS. 2 and 3 are plan views showing the back side of the printed board circuit according to the present invention. Explanation of symbols of main parts, 10...Printed circuit board, 12...Earth land, 13...Hot land, 20...Slit, 20A, 20
B, 20C... Slit section, 22.
...Part of the board, 24A, 24B, 24C...
...Support part.
Claims (1)
準電位ｉ接続された導電層からなる第１の回路パターン
と、該基板上に形成され回路のホット側接続を構盛スる
導電層からなる第２の回路パターンとを含むプリント板
回路であって、該第２の回路パターンは、前記基板に設
けられ・たスリットによって周囲を実質的に包囲され、
該第２の回路パターンに接続された部品によって前記基
板に機械的に支持されていることを特徴とするプリント
板回路。A first circuit pattern consisting of a substrate made of an insulating material, a conductive layer formed on the substrate and connected to a reference potential of the circuit, and a conductive layer formed on the substrate and configured to make a hot side connection of the circuit. a second circuit pattern consisting of a printed circuit board, the second circuit pattern being substantially surrounded by a slit provided in the substrate;
A printed board circuit, characterized in that it is mechanically supported by the substrate by components connected to the second circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP147182U JPS58105164U (en) | 1982-01-09 | 1982-01-09 | printed board circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP147182U JPS58105164U (en) | 1982-01-09 | 1982-01-09 | printed board circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58105164U true JPS58105164U (en) | 1983-07-18 |
Family
ID=30014485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP147182U Pending JPS58105164U (en) | 1982-01-09 | 1982-01-09 | printed board circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58105164U (en) |
-
1982
- 1982-01-09 JP JP147182U patent/JPS58105164U/en active Pending
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