JPS60119771U

JPS60119771U - hybrid integrated circuit board

Info

Publication number: JPS60119771U
Application number: JP17066183U
Authority: JP
Inventors: 幸孝徳本
Original assignee: 関西日本電気株式会社
Priority date: 1983-10-31
Filing date: 1983-10-31
Publication date: 1985-08-13

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１区は、一般的なＨＩＣの断面図、第２図はそのＨＩ
Ｃ基板にコンデンサを形成した場合の要部断面図、第３
図〜第６図は、この考案の第１実施例〜第４実施例を示
すＨＩＣ基板の要部断面図である。１１・・・・・・絶縁基板、１２．１３・・・・・・基
板の一部（誘電体）、１４，１５，１７，１８，２５，
２６．３１．３２・・・・・・電極パターン、１６，１
９゜２０．２２．３４・・・・・・コンデンサ、２１，
２７゜２８・・・・・・高誘電率材料。補正　昭５９．７．３０考案の名称を次のように補正する。 ■考案の名称　　混成集積回路基板実用新案登録請求の範囲を次のｊうに補正する。Ｏ実用新案登録請求の範囲抵抗や導体パターンを厚膜印刷する絶縁基板の一部に、
対向近接する電極パターンを形成し、前記電極パターン
間に、誘電体として絶縁基板の一部、若しくは、高誘電
率材料を介在させることを特徴とする混成集積回路基板
。図面の簡単な説明を次のように補正する。 −明細書第８頁第２行〜第５行目の１一般的なＨＩＣ−
・・・−ＨＩＣ基板の要部断面図、を１一般的な厚膜混
成集積回路の断面図、第２図は、その厚膜混成集積回路
基板に、コンデンサを形成した場合の要部断面図、第３
図〜第６図は、この考案の第１実施例７第４実施例を示
す厚膜混成集積回路基板の要部断面図１と訂正する。Section 1 is a cross-sectional view of a typical HIC, and Fig. 2 is its HI
Main part sectional view when a capacitor is formed on the C board, 3rd
6 are sectional views of essential parts of HIC boards showing first to fourth embodiments of this invention. 11... Insulating substrate, 12.13... Part of substrate (dielectric), 14, 15, 17, 18, 25,
26.31.32... Electrode pattern, 16,1
9゜20.22.34... Capacitor, 21,
27゜28...High dielectric constant material. Amendment July 30, 1982 The name of the invention is amended as follows. ■Name of the invention The scope of the claim for hybrid integrated circuit board utility model registration is amended as follows. O Utility Model Registration Claims A portion of an insulating substrate on which a resistor or conductive pattern is thickly printed,
1. A hybrid integrated circuit board, characterized in that electrode patterns are formed in close proximity to each other, and a part of an insulating substrate or a high dielectric constant material is interposed as a dielectric between the electrode patterns. The brief description of the drawing has been amended as follows. - 1 common HIC on page 8, lines 2 to 5 of the specification -
...-A sectional view of the main parts of an HIC board, 1 a sectional view of a general thick film hybrid integrated circuit, and 2 a sectional view of the main parts when a capacitor is formed on the thick film hybrid integrated circuit board. , 3rd
6 to 6 are corrected to be sectional views 1 of essential parts of a thick film hybrid integrated circuit board showing the first embodiment 7 and the fourth embodiment of this invention.

Claims

[Scope of utility model registration request]

On a part of an insulating substrate on which a thick film of resistance or conductor pattern is printed,
1. A HIC substrate, characterized in that electrode patterns are formed in close proximity to each other, and a part of an insulating substrate or a high dielectric constant material is interposed as a dielectric between the electrode patterns.