JPS58103567A - 導電性ペイント - Google Patents

Info

Publication number

JPS58103567A

JPS58103567A JP20221181A JP20221181A JPS58103567A JP S58103567 A JPS58103567 A JP S58103567A JP 20221181 A JP20221181 A JP 20221181A JP 20221181 A JP20221181 A JP 20221181A JP S58103567 A JPS58103567 A JP S58103567A

Authority

JP

Japan

Prior art keywords

paint

conductive

powder

solvent

conductive paint

Prior art date

1981-12-14

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Links

• Espacenet
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• 239000003973 paint Substances 0.000 title claims abstract description 32
• 239000000843 powder Substances 0.000 claims abstract description 48
• 229910045601 alloy Inorganic materials 0.000 claims abstract description 20
• 239000000956 alloy Substances 0.000 claims abstract description 20
• 239000011347 resin Substances 0.000 claims abstract description 8
• 229920005989 resin Polymers 0.000 claims abstract description 8
• QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims abstract description 7
• 239000002904 solvent Substances 0.000 claims abstract description 6
• 239000003960 organic solvent Substances 0.000 claims abstract description 3
• 238000001035 drying Methods 0.000 claims abstract 2
• 229910052751 metal Inorganic materials 0.000 claims description 3
• 239000002184 metal Substances 0.000 claims description 3
• 238000013508 migration Methods 0.000 abstract description 16
• 230000005012 migration Effects 0.000 abstract description 16
• 239000005011 phenolic resin Substances 0.000 abstract description 6
• 239000000758 substrate Substances 0.000 abstract description 5
• 239000002245 particle Substances 0.000 abstract description 4
• 238000007650 screen-printing Methods 0.000 abstract description 4
• 229920001187 thermosetting polymer Polymers 0.000 abstract description 4
• KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 3
• CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 abstract description 3
• 238000010438 heat treatment Methods 0.000 abstract description 3
• 229920001568 phenolic resin Polymers 0.000 abstract description 3
• 229910052709 silver Inorganic materials 0.000 abstract description 3
• 239000008096 xylene Substances 0.000 abstract description 3
• 239000013522 chelant Substances 0.000 abstract description 2
• 239000010409 thin film Substances 0.000 abstract description 2
• 229910052718 tin Inorganic materials 0.000 abstract description 2
• 229910020888 Sn-Cu Inorganic materials 0.000 abstract 1
• 229910019204 Sn—Cu Inorganic materials 0.000 abstract 1
• XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 abstract 1
• 238000000926 separation method Methods 0.000 abstract 1
• 229910000881 Cu alloy Inorganic materials 0.000 description 9
• 238000000034 method Methods 0.000 description 8
• 239000012964 benzotriazole Substances 0.000 description 5
• 230000007797 corrosion Effects 0.000 description 5
• 238000005260 corrosion Methods 0.000 description 5
• CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
• KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 4
• 238000005275 alloying Methods 0.000 description 4
• 230000003647 oxidation Effects 0.000 description 4
• 238000007254 oxidation reaction Methods 0.000 description 4
• 230000000694 effects Effects 0.000 description 3
• 229910017944 Ag—Cu Inorganic materials 0.000 description 2
• IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
• 239000010953 base metal Substances 0.000 description 2
• 125000005605 benzo group Chemical group 0.000 description 2
• 229910001873 dinitrogen Inorganic materials 0.000 description 2
• 238000013007 heat curing Methods 0.000 description 2
• 238000004898 kneading Methods 0.000 description 2
• 239000000203 mixture Substances 0.000 description 2
• 239000007921 spray Substances 0.000 description 2
• 238000012360 testing method Methods 0.000 description 2
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
• 150000001875 compounds Chemical class 0.000 description 1
• 239000004020 conductor Substances 0.000 description 1
• 238000001816 cooling Methods 0.000 description 1
• 238000001723 curing Methods 0.000 description 1
• 230000007547 defect Effects 0.000 description 1
• 230000005684 electric field Effects 0.000 description 1
• 230000007613 environmental effect Effects 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
• 239000010408 film Substances 0.000 description 1
• 230000006872 improvement Effects 0.000 description 1
• 230000003993 interaction Effects 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 238000005259 measurement Methods 0.000 description 1
• 229910000510 noble metal Inorganic materials 0.000 description 1
• 229910052763 palladium Inorganic materials 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 239000010970 precious metal Substances 0.000 description 1
• 230000008569 process Effects 0.000 description 1
• 238000011160 research Methods 0.000 description 1
• 239000004065 semiconductor Substances 0.000 description 1
• 238000012546 transfer Methods 0.000 description 1

Cited By (3)