JPS5799767A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5799767A
JPS5799767A JP55176726A JP17672680A JPS5799767A JP S5799767 A JPS5799767 A JP S5799767A JP 55176726 A JP55176726 A JP 55176726A JP 17672680 A JP17672680 A JP 17672680A JP S5799767 A JPS5799767 A JP S5799767A
Authority
JP
Japan
Prior art keywords
capacity
conductor
slat
substrate
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55176726A
Other languages
English (en)
Inventor
Yoshinobu Kadowaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55176726A priority Critical patent/JPS5799767A/ja
Publication of JPS5799767A publication Critical patent/JPS5799767A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP55176726A 1980-12-11 1980-12-11 Semiconductor device Pending JPS5799767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55176726A JPS5799767A (en) 1980-12-11 1980-12-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55176726A JPS5799767A (en) 1980-12-11 1980-12-11 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5799767A true JPS5799767A (en) 1982-06-21

Family

ID=16018700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55176726A Pending JPS5799767A (en) 1980-12-11 1980-12-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5799767A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595655A (ja) * 1982-07-01 1984-01-12 Fujitsu Ltd 半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595655A (ja) * 1982-07-01 1984-01-12 Fujitsu Ltd 半導体装置の製造方法
JPH0216587B2 (ja) * 1982-07-01 1990-04-17 Fujitsu Ltd

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