JPS5796559A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5796559A
JPS5796559A JP55173525A JP17352580A JPS5796559A JP S5796559 A JPS5796559 A JP S5796559A JP 55173525 A JP55173525 A JP 55173525A JP 17352580 A JP17352580 A JP 17352580A JP S5796559 A JPS5796559 A JP S5796559A
Authority
JP
Japan
Prior art keywords
resin
screw hole
radiator
distance
distances
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55173525A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130750B2 (enExample
Inventor
Hideo Sakauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55173525A priority Critical patent/JPS5796559A/ja
Publication of JPS5796559A publication Critical patent/JPS5796559A/ja
Publication of JPS6130750B2 publication Critical patent/JPS6130750B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP55173525A 1980-12-09 1980-12-09 Semiconductor device Granted JPS5796559A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55173525A JPS5796559A (en) 1980-12-09 1980-12-09 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55173525A JPS5796559A (en) 1980-12-09 1980-12-09 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5796559A true JPS5796559A (en) 1982-06-15
JPS6130750B2 JPS6130750B2 (enExample) 1986-07-15

Family

ID=15962132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55173525A Granted JPS5796559A (en) 1980-12-09 1980-12-09 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5796559A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4571611A (en) * 1982-03-31 1986-02-18 Fujitsu Limited Semiconductor chip with a metal heat radiator
EP0684641A3 (en) * 1994-05-26 1996-11-06 Nec Corp Encapsulation of a semiconductor device with high moisture resistance.
US6002173A (en) * 1991-12-20 1999-12-14 Sgs-Thomson Microelectronics S.R.L. Semiconductor device package with metal-polymer joint of controlled roughness

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4571611A (en) * 1982-03-31 1986-02-18 Fujitsu Limited Semiconductor chip with a metal heat radiator
US6002173A (en) * 1991-12-20 1999-12-14 Sgs-Thomson Microelectronics S.R.L. Semiconductor device package with metal-polymer joint of controlled roughness
EP0684641A3 (en) * 1994-05-26 1996-11-06 Nec Corp Encapsulation of a semiconductor device with high moisture resistance.
US5793118A (en) * 1994-05-26 1998-08-11 Nec Corporation Semiconductor device capable of accomplishing a high moisture proof

Also Published As

Publication number Publication date
JPS6130750B2 (enExample) 1986-07-15

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