JPS5790984A - Optical information transfer device and fabrication thereof - Google Patents

Optical information transfer device and fabrication thereof

Info

Publication number
JPS5790984A
JPS5790984A JP16727880A JP16727880A JPS5790984A JP S5790984 A JPS5790984 A JP S5790984A JP 16727880 A JP16727880 A JP 16727880A JP 16727880 A JP16727880 A JP 16727880A JP S5790984 A JPS5790984 A JP S5790984A
Authority
JP
Japan
Prior art keywords
layer
recesses
leds
optical
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16727880A
Other languages
Japanese (ja)
Inventor
Takehiko Iwaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP16727880A priority Critical patent/JPS5790984A/en
Publication of JPS5790984A publication Critical patent/JPS5790984A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Devices (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To improve optical transfer efficiency by a method wherein holes with a fixed diameter are built on an outer layer deposited on part of an LED and therein the end of optical fibers is inserted and adhered. CONSTITUTION:P and N type Ga1-xAlxAs layers 2 and 3 are laminated on a GaAs substrate 1, and Au electrodes 4 and 5 are vaporized on the bottom surface 4 and the upper surface 5. An SiO2 layer 6 nearly 20mum thick is laid on the electrode 5, and recesses 7 are selectively etched away to form mesa-typed LEDs in array. The depth of recesses 7 is determined properly so that separation and resolution are adequately harmonized. Next, holes 8 with a fixed diameter and reaching the layer 3 are selectively etched away in layer 6 and electrode 5 and cut along the lines 9 to produce LEDs in array. An end of an optical fiber 10 is inserted into each hole 8 and fixed to the SiO2 layer 6 with an adhesive. With this structure, LEDs and optical fibers are securely integrated without light leakage from joints to improve an optical transfer efficiency. Laying of an insulating reflective film on the etched surface 12 of recesses is effective. This is also effective for elements emitting light in parallel with a P-N junction surface.
JP16727880A 1980-11-27 1980-11-27 Optical information transfer device and fabrication thereof Pending JPS5790984A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16727880A JPS5790984A (en) 1980-11-27 1980-11-27 Optical information transfer device and fabrication thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16727880A JPS5790984A (en) 1980-11-27 1980-11-27 Optical information transfer device and fabrication thereof

Publications (1)

Publication Number Publication Date
JPS5790984A true JPS5790984A (en) 1982-06-05

Family

ID=15846773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16727880A Pending JPS5790984A (en) 1980-11-27 1980-11-27 Optical information transfer device and fabrication thereof

Country Status (1)

Country Link
JP (1) JPS5790984A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04250673A (en) * 1991-01-16 1992-09-07 Toshiba Corp Semiconductor light emitting element and manufacture thereof
US5296072A (en) * 1991-11-25 1994-03-22 Corning Incorporated Method of manufacturing and testing integrated optical components
JPH0694937A (en) * 1992-03-30 1994-04-08 American Teleph & Telegr Co <Att> Method for connecting waveguide on substrate and waveguide substrate having optical fiber
EP0606552A1 (en) * 1993-01-05 1994-07-20 Motorola, Inc. Modular optical waveguide and method for making
WO2007021066A1 (en) * 2005-08-16 2007-02-22 Postech Academy-Industry Foundation Butt coupling structure and method of photonic quantum ring hole emitter
CN114038985A (en) * 2021-11-01 2022-02-11 上海天马微电子有限公司 Display panel, preparation method thereof and display device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04250673A (en) * 1991-01-16 1992-09-07 Toshiba Corp Semiconductor light emitting element and manufacture thereof
US5296072A (en) * 1991-11-25 1994-03-22 Corning Incorporated Method of manufacturing and testing integrated optical components
AU661731B2 (en) * 1991-11-25 1995-08-03 Corning Incorporated Method of manufacturing and testing integrated optical components
US5447585A (en) * 1991-11-25 1995-09-05 Corning Incorporated Method of manufacturing and testing integrated optical components
JPH0694937A (en) * 1992-03-30 1994-04-08 American Teleph & Telegr Co <Att> Method for connecting waveguide on substrate and waveguide substrate having optical fiber
EP0606552A1 (en) * 1993-01-05 1994-07-20 Motorola, Inc. Modular optical waveguide and method for making
WO2007021066A1 (en) * 2005-08-16 2007-02-22 Postech Academy-Industry Foundation Butt coupling structure and method of photonic quantum ring hole emitter
US7520681B2 (en) 2005-08-16 2009-04-21 Postech Academy-Industry Foundation Butt coupling structure and method of photonic quantum ring hole emitter
CN114038985A (en) * 2021-11-01 2022-02-11 上海天马微电子有限公司 Display panel, preparation method thereof and display device

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