JPS5789231A - Semiconductor circuit device - Google Patents
Semiconductor circuit deviceInfo
- Publication number
- JPS5789231A JPS5789231A JP16456780A JP16456780A JPS5789231A JP S5789231 A JPS5789231 A JP S5789231A JP 16456780 A JP16456780 A JP 16456780A JP 16456780 A JP16456780 A JP 16456780A JP S5789231 A JPS5789231 A JP S5789231A
- Authority
- JP
- Japan
- Prior art keywords
- electrostatic capacity
- pin
- input
- pins
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W99/00—
-
- H10W90/754—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16456780A JPS5789231A (en) | 1980-11-25 | 1980-11-25 | Semiconductor circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16456780A JPS5789231A (en) | 1980-11-25 | 1980-11-25 | Semiconductor circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5789231A true JPS5789231A (en) | 1982-06-03 |
| JPH0125227B2 JPH0125227B2 (enExample) | 1989-05-16 |
Family
ID=15795614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16456780A Granted JPS5789231A (en) | 1980-11-25 | 1980-11-25 | Semiconductor circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5789231A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012522398A (ja) * | 2009-03-30 | 2012-09-20 | メギカ・コーポレイション | 上部ポストパッシベーション技術および底部構造技術を使用する集積回路チップ |
-
1980
- 1980-11-25 JP JP16456780A patent/JPS5789231A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012522398A (ja) * | 2009-03-30 | 2012-09-20 | メギカ・コーポレイション | 上部ポストパッシベーション技術および底部構造技術を使用する集積回路チップ |
| JP2015073107A (ja) * | 2009-03-30 | 2015-04-16 | クゥアルコム・インコーポレイテッドQualcomm Incorporated | 上部ポストパッシベーション技術および底部構造技術を使用する集積回路チップ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0125227B2 (enExample) | 1989-05-16 |
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