JPS5784137A - Plasma chemical evaporation - Google Patents
Plasma chemical evaporationInfo
- Publication number
- JPS5784137A JPS5784137A JP15944480A JP15944480A JPS5784137A JP S5784137 A JPS5784137 A JP S5784137A JP 15944480 A JP15944480 A JP 15944480A JP 15944480 A JP15944480 A JP 15944480A JP S5784137 A JPS5784137 A JP S5784137A
- Authority
- JP
- Japan
- Prior art keywords
- insulator substrate
- electrode
- plate
- insulator
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
- C23C16/5096—Flat-bed apparatus
Abstract
PURPOSE:To unify ditribution of film thickness and distribution of resistance value of a thin film to be formed on the surface of an insulator substrate by a method wherein one side electrode of a pair of parallel plane type electrodes to put the insulator substrate thereon is covered with an insulator. CONSTITUTION:The parallel plane type electrode 3 or 4 is insulated with one of alumina, ceramic, glass, polyimide, Teflon, quartz glass. The insulator substrate to be put on the electrode 3 or 4 is selected from one of alumina, ceramic plate, single crystal sapphire plate, Mylar plate, resin plate of polyimide, borosilicate glass. The inside of a reaction chamber is held at a vacuum, silane gas is introduced from a material gas introducing port 5, a high-frequency voltage is applied between the electodes 3, 4 to convert gas in the reaction chamber into plasma, and the amrophous silicon thin film containing hydrogen is formed on the surface of the insulator substrate put on the electrode covered with the insulating film. Accordingly distribution of film thickness and resistance value can be uniformed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15944480A JPS5784137A (en) | 1980-11-14 | 1980-11-14 | Plasma chemical evaporation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15944480A JPS5784137A (en) | 1980-11-14 | 1980-11-14 | Plasma chemical evaporation |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5784137A true JPS5784137A (en) | 1982-05-26 |
Family
ID=15693881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15944480A Pending JPS5784137A (en) | 1980-11-14 | 1980-11-14 | Plasma chemical evaporation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5784137A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2587732A1 (en) * | 1985-09-26 | 1987-03-27 | Centre Nat Rech Scient | Reactor for plasma-assisted vapour-phase chemical deposition |
JPS6337615A (en) * | 1986-07-31 | 1988-02-18 | Tokyo Electron Ltd | Plasma electrode |
JPS6358920A (en) * | 1986-08-29 | 1988-03-14 | Tokyo Electron Ltd | Plasma electrode |
JPH01125530U (en) * | 1988-05-12 | 1989-08-28 | ||
US5705019A (en) * | 1994-10-26 | 1998-01-06 | Sumitomo Metal Industries, Ltd. | Plasma processing apparatus |
GB2563264A (en) * | 2017-06-08 | 2018-12-12 | Jaguar Land Rover Ltd | Vehicle parcel shelf |
-
1980
- 1980-11-14 JP JP15944480A patent/JPS5784137A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2587732A1 (en) * | 1985-09-26 | 1987-03-27 | Centre Nat Rech Scient | Reactor for plasma-assisted vapour-phase chemical deposition |
JPS6337615A (en) * | 1986-07-31 | 1988-02-18 | Tokyo Electron Ltd | Plasma electrode |
JPH0556853B2 (en) * | 1986-07-31 | 1993-08-20 | Tokyo Electron Ltd | |
JPS6358920A (en) * | 1986-08-29 | 1988-03-14 | Tokyo Electron Ltd | Plasma electrode |
JPH01125530U (en) * | 1988-05-12 | 1989-08-28 | ||
JPH0351971Y2 (en) * | 1988-05-12 | 1991-11-08 | ||
US5705019A (en) * | 1994-10-26 | 1998-01-06 | Sumitomo Metal Industries, Ltd. | Plasma processing apparatus |
GB2563264A (en) * | 2017-06-08 | 2018-12-12 | Jaguar Land Rover Ltd | Vehicle parcel shelf |
GB2563264B (en) * | 2017-06-08 | 2019-12-25 | Jaguar Land Rover Ltd | Vehicle parcel shelf |
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