JPS56109432A - Manufacture of gas discharge panel - Google Patents
Manufacture of gas discharge panelInfo
- Publication number
- JPS56109432A JPS56109432A JP1109080A JP1109080A JPS56109432A JP S56109432 A JPS56109432 A JP S56109432A JP 1109080 A JP1109080 A JP 1109080A JP 1109080 A JP1109080 A JP 1109080A JP S56109432 A JPS56109432 A JP S56109432A
- Authority
- JP
- Japan
- Prior art keywords
- material layer
- dielectric material
- substrate
- temperature
- gas discharge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
Abstract
PURPOSE:To prevent a dielectirc material layer from crack, when coating the electrode arranged on a substrate with dielectric material layer, by employing specific relation between the temperature of the substrate and the adhering speed of the dielectric material layer while employing the dielectric layer containing silicon dioxide more than specific amount. CONSTITUTION:Conductive electrodes 2 are arranged with specific pattern on a glass substrate 1 and coated with dielectric material layer 3 then faced each other through gas discharge space 4. Here the dielectric material layer 3 is composed of more than 90wt% of silicon dioxide while the temperature (t) of the substrate is set in the range from 150 deg.C to the softening point of the substrate, then said temperature and the adhering speed R of the dielectric material layer are selected to satisfy the relation R<=17t-2,500. Consequently the crack isn't produced in the dielectric material layer film 3 during thermal processing for forming the discharge panel, resulting in considerable improvement of the quality.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55011090A JPS607337B2 (en) | 1980-01-31 | 1980-01-31 | How to manufacture gas discharge panels |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55011090A JPS607337B2 (en) | 1980-01-31 | 1980-01-31 | How to manufacture gas discharge panels |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56109432A true JPS56109432A (en) | 1981-08-29 |
JPS607337B2 JPS607337B2 (en) | 1985-02-23 |
Family
ID=11768280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55011090A Expired JPS607337B2 (en) | 1980-01-31 | 1980-01-31 | How to manufacture gas discharge panels |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS607337B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6450849B1 (en) | 1998-07-07 | 2002-09-17 | Fujitsu Limited | Method of manufacturing gas discharge display devices using plasma enhanced vapor deposition |
-
1980
- 1980-01-31 JP JP55011090A patent/JPS607337B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6450849B1 (en) | 1998-07-07 | 2002-09-17 | Fujitsu Limited | Method of manufacturing gas discharge display devices using plasma enhanced vapor deposition |
Also Published As
Publication number | Publication date |
---|---|
JPS607337B2 (en) | 1985-02-23 |
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