JPS5779632A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5779632A JPS5779632A JP15457680A JP15457680A JPS5779632A JP S5779632 A JPS5779632 A JP S5779632A JP 15457680 A JP15457680 A JP 15457680A JP 15457680 A JP15457680 A JP 15457680A JP S5779632 A JPS5779632 A JP S5779632A
- Authority
- JP
- Japan
- Prior art keywords
- grow
- silicon
- epitaxial layer
- layer
- type silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photoreceptors In Electrophotography (AREA)
- Local Oxidation Of Silicon (AREA)
- Bipolar Transistors (AREA)
- Element Separation (AREA)
Abstract
PURPOSE:To obtain a semiconductor device with enhanced dilelctric withstand voltage and being enabled to intergrated even a high voltage circuit by a method wherein the device is made to have silicon/magnesia spinel/silicon structure. CONSTITUTION:A concave part 12 is formed on a silicon substrate 11, and a magnesia spinel (MgO.Al2O3) layer 13 is made to grow adhering on the substrate 11. Then a P<+> type silicon epitaxial layer 14 is made to grow on the upper face of the MgO.Al2O3 layer, and a P type silicon epitaxial layer 15 is made to grow the same on the upper face thereof. Moreover it is polished up to expose the P type silicon epitaxial layer, and the region in the convex region necessitating to be isolated is oxidized to form silicon dioxide layers 18.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15457680A JPS5779632A (en) | 1980-11-05 | 1980-11-05 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15457680A JPS5779632A (en) | 1980-11-05 | 1980-11-05 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5779632A true JPS5779632A (en) | 1982-05-18 |
Family
ID=15587236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15457680A Pending JPS5779632A (en) | 1980-11-05 | 1980-11-05 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5779632A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5484738A (en) * | 1992-06-17 | 1996-01-16 | International Business Machines Corporation | Method of forming silicon on oxide semiconductor device structure for BiCMOS integrated circuits |
-
1980
- 1980-11-05 JP JP15457680A patent/JPS5779632A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5484738A (en) * | 1992-06-17 | 1996-01-16 | International Business Machines Corporation | Method of forming silicon on oxide semiconductor device structure for BiCMOS integrated circuits |
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