JPS5776187A - Treatment by etching - Google Patents

Treatment by etching

Info

Publication number
JPS5776187A
JPS5776187A JP15250580A JP15250580A JPS5776187A JP S5776187 A JPS5776187 A JP S5776187A JP 15250580 A JP15250580 A JP 15250580A JP 15250580 A JP15250580 A JP 15250580A JP S5776187 A JPS5776187 A JP S5776187A
Authority
JP
Japan
Prior art keywords
electrode
electrodes
reactor container
container
turned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15250580A
Other languages
Japanese (ja)
Inventor
Naomichi Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15250580A priority Critical patent/JPS5776187A/en
Publication of JPS5776187A publication Critical patent/JPS5776187A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE:To form a semiconductor element with a wiring film free of disconnection and cracking in the neighborhood of opening by a method in which an electrode on which a base plate to be treated is placed in turned in an inclined manner to a counter electrode and parallel magnetic fields are provided to electric field between the electrodes. CONSTITUTION:In a reactor container 11, an electrode 16 on which a semiconductor base plate 15 to be treated is placed and a counter electrode 14 are provided. The reactor container 11 is evacuated, and a high voltage is applied between the electrodes 14 and 16 by a high frequency oscillator 18 while introducing CHF3 gas into the container 11 through a duct 12. At this time, the electrode 16 is turned in an inclined manner to the electrode 14 in such a way that parallel magnetic fields can act on electric field produced between the electrodes 14 and 16 by copper coil 19, for example, surrounding the outer wall of the reactor container 11.
JP15250580A 1980-10-30 1980-10-30 Treatment by etching Pending JPS5776187A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15250580A JPS5776187A (en) 1980-10-30 1980-10-30 Treatment by etching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15250580A JPS5776187A (en) 1980-10-30 1980-10-30 Treatment by etching

Publications (1)

Publication Number Publication Date
JPS5776187A true JPS5776187A (en) 1982-05-13

Family

ID=15541918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15250580A Pending JPS5776187A (en) 1980-10-30 1980-10-30 Treatment by etching

Country Status (1)

Country Link
JP (1) JPS5776187A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056076A (en) * 1983-09-08 1985-04-01 Ulvac Corp Sputter etching device
JPS61119684A (en) * 1984-11-14 1986-06-06 Ulvac Corp Sputter etching device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056076A (en) * 1983-09-08 1985-04-01 Ulvac Corp Sputter etching device
JPS61119684A (en) * 1984-11-14 1986-06-06 Ulvac Corp Sputter etching device

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