JPS6431421A - Microwave plasma treatment device - Google Patents
Microwave plasma treatment deviceInfo
- Publication number
- JPS6431421A JPS6431421A JP62187338A JP18733887A JPS6431421A JP S6431421 A JPS6431421 A JP S6431421A JP 62187338 A JP62187338 A JP 62187338A JP 18733887 A JP18733887 A JP 18733887A JP S6431421 A JPS6431421 A JP S6431421A
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- plasma chamber
- high frequency
- power source
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Plasma Technology (AREA)
- ing And Chemical Polishing (AREA)
- Structure Of Printed Boards (AREA)
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE:To secure the uniformity of treatment and improve the rate of treatment, by providing a high frequency power source or a direct current power source connected to a plasma chamber and in addition to earthing a substrate holder where a treated substrate is placed and by applying a high frequency voltage or a direct current voltage to the plasma chamber itself. CONSTITUTION:Microwaves generated by a microwave generator 3 are introduced into a plasma chamber 6 through a waveguide 4. Once an electric current is supplied from a power source 12 to an air-core solenoid coil 7 and a magnetic field having a prescribed intensity is generated, the cyclotron resonance of electron is induced and its energy allows an etching gas in the plasma chamber to produce a plasma state with high density. After a high frequency biased voltage is applied from the high frequency electric power 14 to the plasma chamber 6 (or a direct biased voltage is applied from a direct electric power 15), ions are extracted from an outlet 17 of plasma leading circular plates 11. Appearances of extracted plasma are extremely uniformized on a plasma substrate 10 and then the uniformity of etching treatment is exceedingly improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62187338A JPS6431421A (en) | 1987-07-27 | 1987-07-27 | Microwave plasma treatment device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62187338A JPS6431421A (en) | 1987-07-27 | 1987-07-27 | Microwave plasma treatment device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6431421A true JPS6431421A (en) | 1989-02-01 |
Family
ID=16204251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62187338A Pending JPS6431421A (en) | 1987-07-27 | 1987-07-27 | Microwave plasma treatment device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6431421A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04235283A (en) * | 1990-12-31 | 1992-08-24 | Semiconductor Energy Lab Co Ltd | Apparatus and method for forming coating film |
JPH0544041A (en) * | 1990-12-12 | 1993-02-23 | Semiconductor Energy Lab Co Ltd | Film forming device and film formation |
CN103269557A (en) * | 2013-04-28 | 2013-08-28 | 大连民族学院 | Radio frequency ion source |
-
1987
- 1987-07-27 JP JP62187338A patent/JPS6431421A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0544041A (en) * | 1990-12-12 | 1993-02-23 | Semiconductor Energy Lab Co Ltd | Film forming device and film formation |
JPH04235283A (en) * | 1990-12-31 | 1992-08-24 | Semiconductor Energy Lab Co Ltd | Apparatus and method for forming coating film |
CN103269557A (en) * | 2013-04-28 | 2013-08-28 | 大连民族学院 | Radio frequency ion source |
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