JPS6418236A - Removal of static electricity - Google Patents
Removal of static electricityInfo
- Publication number
- JPS6418236A JPS6418236A JP62174270A JP17427087A JPS6418236A JP S6418236 A JPS6418236 A JP S6418236A JP 62174270 A JP62174270 A JP 62174270A JP 17427087 A JP17427087 A JP 17427087A JP S6418236 A JPS6418236 A JP S6418236A
- Authority
- JP
- Japan
- Prior art keywords
- static electricity
- alternating
- impressed
- current high
- chuck electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Jigs For Machine Tools (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
PURPOSE:To simply remove static electricity from an insulating material or the like arranged inside a high-vacuum chamber of a manufacturing device for a semiconductor by a method wherein an alternating field is impressed on the insulating material which has been electrified by the static electricity. CONSTITUTION:Coating layers 13a, 13b formed on the surface of chuck electrodes 11a, 11b composed of a conductive metal are exposed to a strong electric field and are electrified by static electricity. Therefore, a switching part 15 is actuated by an off signal input by a control device 14; the chuck electrodes 11a, 11b are connected to an alternating-current high-voltage power supply 17; an alternating-current high voltage is impressed on the chuck electrodes 11a, 11b from the alternating-current high-voltage power supply 17; an alternating field is impressed on the coating layers 13a, 13b which are insulating materials. By this setup, it is simple to remove the static electricity from the insulating materials or the like which are arranged inside a high-vacuum chamber of a manufacturing device for a semiconductor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62174270A JPS6418236A (en) | 1987-07-13 | 1987-07-13 | Removal of static electricity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62174270A JPS6418236A (en) | 1987-07-13 | 1987-07-13 | Removal of static electricity |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6418236A true JPS6418236A (en) | 1989-01-23 |
Family
ID=15975717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62174270A Pending JPS6418236A (en) | 1987-07-13 | 1987-07-13 | Removal of static electricity |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6418236A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5491603A (en) * | 1994-04-28 | 1996-02-13 | Applied Materials, Inc. | Method of determining a dechucking voltage which nullifies a residual electrostatic force between an electrostatic chuck and a wafer |
US5583737A (en) * | 1992-12-02 | 1996-12-10 | Applied Materials, Inc. | Electrostatic chuck usable in high density plasma |
US5684669A (en) * | 1995-06-07 | 1997-11-04 | Applied Materials, Inc. | Method for dechucking a workpiece from an electrostatic chuck |
US5825607A (en) * | 1996-05-08 | 1998-10-20 | Applied Materials, Inc. | Insulated wafer spacing mask for a substrate support chuck and method of fabricating same |
JPH11106916A (en) * | 1997-10-01 | 1999-04-20 | Anelva Corp | Plasma treating device |
JP2006337026A (en) * | 2005-05-31 | 2006-12-14 | Hitachi High-Technologies Corp | Liquid feed substrate and analysis system |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6244332A (en) * | 1985-08-23 | 1987-02-26 | Canon Inc | Electro-static absorber |
-
1987
- 1987-07-13 JP JP62174270A patent/JPS6418236A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6244332A (en) * | 1985-08-23 | 1987-02-26 | Canon Inc | Electro-static absorber |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5583737A (en) * | 1992-12-02 | 1996-12-10 | Applied Materials, Inc. | Electrostatic chuck usable in high density plasma |
US5874361A (en) * | 1992-12-02 | 1999-02-23 | Applied Materials, Inc. | Method of processing a wafer within a reaction chamber |
US5491603A (en) * | 1994-04-28 | 1996-02-13 | Applied Materials, Inc. | Method of determining a dechucking voltage which nullifies a residual electrostatic force between an electrostatic chuck and a wafer |
US5684669A (en) * | 1995-06-07 | 1997-11-04 | Applied Materials, Inc. | Method for dechucking a workpiece from an electrostatic chuck |
US5825607A (en) * | 1996-05-08 | 1998-10-20 | Applied Materials, Inc. | Insulated wafer spacing mask for a substrate support chuck and method of fabricating same |
JPH11106916A (en) * | 1997-10-01 | 1999-04-20 | Anelva Corp | Plasma treating device |
JP2006337026A (en) * | 2005-05-31 | 2006-12-14 | Hitachi High-Technologies Corp | Liquid feed substrate and analysis system |
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