JPS5775777A - Polishing machine - Google Patents

Polishing machine

Info

Publication number
JPS5775777A
JPS5775777A JP55150111A JP15011180A JPS5775777A JP S5775777 A JPS5775777 A JP S5775777A JP 55150111 A JP55150111 A JP 55150111A JP 15011180 A JP15011180 A JP 15011180A JP S5775777 A JPS5775777 A JP S5775777A
Authority
JP
Japan
Prior art keywords
thickness
detector element
temperature
output
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55150111A
Other languages
Japanese (ja)
Inventor
Hatsuyuki Arai
Seiichi Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUPIIDE FUAMU KK
SUPIIDO FUAMU KK
Speedfam Corp
Original Assignee
SUPIIDE FUAMU KK
SUPIIDO FUAMU KK
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUPIIDE FUAMU KK, SUPIIDO FUAMU KK, Speedfam Corp filed Critical SUPIIDE FUAMU KK
Priority to JP55150111A priority Critical patent/JPS5775777A/en
Publication of JPS5775777A publication Critical patent/JPS5775777A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve accuracy of thickness by installing in a cavity provided to the surface plate a thickness detector element which continuously monitors the thickness of item being processed, and by measuring accurate temperature near the coil. CONSTITUTION:A cavity 12 is provided to the upper surface plate 1, cut from above and reaching close to the facing surface of the lower surface plate 2. Removably installed in this cavity 12 is adetector 15 consisting of a thickness detector element 13 and a temperature detector element 14. Although an error is unavoidable for the thickness detector output due to heat generated by polishing operation, a counter measure is provided by the temperature detector element 14 which continuously monitors the temperature near the thickness detector. The output from the temperature detector is transferred through a compensator to the amplifier where it is treated with the output from the thickness detector element 13. Final output from the amplifier is a temperature compensated thickness value of reliable thickness accuracy.
JP55150111A 1980-10-28 1980-10-28 Polishing machine Pending JPS5775777A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55150111A JPS5775777A (en) 1980-10-28 1980-10-28 Polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55150111A JPS5775777A (en) 1980-10-28 1980-10-28 Polishing machine

Publications (1)

Publication Number Publication Date
JPS5775777A true JPS5775777A (en) 1982-05-12

Family

ID=15489722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55150111A Pending JPS5775777A (en) 1980-10-28 1980-10-28 Polishing machine

Country Status (1)

Country Link
JP (1) JPS5775777A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0160860U (en) * 1987-05-21 1989-04-18
JPH02126751U (en) * 1989-03-24 1990-10-18
WO1999024219A1 (en) * 1997-11-07 1999-05-20 Nippon Pillar Packing Co., Ltd. Rotary joint for fluid
GB2380700A (en) * 1998-10-16 2003-04-16 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
JP2016209951A (en) * 2015-05-08 2016-12-15 株式会社ディスコ Dry type polishing device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4852088A (en) * 1971-11-04 1973-07-21
JPS5190095A (en) * 1975-02-05 1976-08-06

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4852088A (en) * 1971-11-04 1973-07-21
JPS5190095A (en) * 1975-02-05 1976-08-06

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0160860U (en) * 1987-05-21 1989-04-18
JPH02126751U (en) * 1989-03-24 1990-10-18
WO1999024219A1 (en) * 1997-11-07 1999-05-20 Nippon Pillar Packing Co., Ltd. Rotary joint for fluid
US6234815B1 (en) 1997-11-07 2001-05-22 Nippin Pillar Packing Co., Ltd. Rotary joint for fluid
GB2380700A (en) * 1998-10-16 2003-04-16 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
GB2380700B (en) * 1998-10-16 2003-05-28 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
JP2016209951A (en) * 2015-05-08 2016-12-15 株式会社ディスコ Dry type polishing device

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