GB2380700B - Wafer polishing apparatus - Google Patents

Wafer polishing apparatus

Info

Publication number
GB2380700B
GB2380700B GB0222814A GB0222814A GB2380700B GB 2380700 B GB2380700 B GB 2380700B GB 0222814 A GB0222814 A GB 0222814A GB 0222814 A GB0222814 A GB 0222814A GB 2380700 B GB2380700 B GB 2380700B
Authority
GB
United Kingdom
Prior art keywords
polishing
wafer
detector
temperature
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0222814A
Other versions
GB0222814D0 (en
GB2380700A (en
Inventor
Takao Inaba
Minoru Numoto
Kenji Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP29575598A external-priority patent/JP3082850B2/en
Priority claimed from JP29571998A external-priority patent/JP3045232B2/en
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority claimed from GB0014585A external-priority patent/GB2347102B/en
Publication of GB0222814D0 publication Critical patent/GB0222814D0/en
Publication of GB2380700A publication Critical patent/GB2380700A/en
Application granted granted Critical
Publication of GB2380700B publication Critical patent/GB2380700B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Wafer polishing apparatus comprises a rotatable polishing platen which carries a polishing cloth, a wafer carrier 412 and a pad 611 and 612 arranged around a wafer which contacts the cloth at a predetermined pressure. The apparatus also comprises a detector 51 and 52 which measures the position of the pad relative to the back of the wafer or the wafer carrier 412. A temperature sensor 72 measures the temperature in the neighbourhood of the detector 51 and 52. The amount of polishing performed is calculated based on the signal from the detector 51 and 52 corrected by the measured temperature. The amount of polishing may also be corrected using measurements from temperature sensors 73 and 74 lying between the detector 51 and 52 and the back of the wafer and between the detector 51 and 52 and the portion of the pad 612 facing the polishing cloth. The temperature sensors 72-74 compensate for the different amounts of thermal expansion experienced by the apparatus during polishing.
GB0222814A 1998-10-16 1999-10-15 Wafer polishing apparatus Expired - Fee Related GB2380700B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP29575598A JP3082850B2 (en) 1998-10-16 1998-10-16 Wafer polishing equipment
JP29571998A JP3045232B2 (en) 1998-10-16 1998-10-16 Wafer polishing apparatus and polishing amount detection method
GB0014585A GB2347102B (en) 1998-10-16 1999-10-15 Wafer polishing apparatus and polishing quantity detection method

Publications (3)

Publication Number Publication Date
GB0222814D0 GB0222814D0 (en) 2002-11-06
GB2380700A GB2380700A (en) 2003-04-16
GB2380700B true GB2380700B (en) 2003-05-28

Family

ID=27255763

Family Applications (2)

Application Number Title Priority Date Filing Date
GB0222815A Expired - Fee Related GB2380960B (en) 1998-10-16 1999-10-15 Wafer polishing apparatus
GB0222814A Expired - Fee Related GB2380700B (en) 1998-10-16 1999-10-15 Wafer polishing apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB0222815A Expired - Fee Related GB2380960B (en) 1998-10-16 1999-10-15 Wafer polishing apparatus

Country Status (1)

Country Link
GB (2) GB2380960B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5775777A (en) * 1980-10-28 1982-05-12 Supiide Fuamu Kk Polishing machine
JPS63256360A (en) * 1987-04-10 1988-10-24 Sumitomo Electric Ind Ltd Measuring device for dimension in grinding
JPH10329014A (en) * 1997-05-26 1998-12-15 Tokyo Seimitsu Co Ltd Wafer polishing device attached with heat insulating mechanism
EP0890416A2 (en) * 1997-07-11 1999-01-13 Tokyo Seimitsu Co.,Ltd. Wafer polishing apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6445568A (en) * 1987-08-11 1989-02-20 Mitsubishi Metal Corp Automatic dimensioning of lapping machine
JPH08288245A (en) * 1995-04-12 1996-11-01 Sony Corp Polishing apparatus and method
US6093081A (en) * 1996-05-09 2000-07-25 Canon Kabushiki Kaisha Polishing method and polishing apparatus using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5775777A (en) * 1980-10-28 1982-05-12 Supiide Fuamu Kk Polishing machine
JPS63256360A (en) * 1987-04-10 1988-10-24 Sumitomo Electric Ind Ltd Measuring device for dimension in grinding
JPH10329014A (en) * 1997-05-26 1998-12-15 Tokyo Seimitsu Co Ltd Wafer polishing device attached with heat insulating mechanism
EP0890416A2 (en) * 1997-07-11 1999-01-13 Tokyo Seimitsu Co.,Ltd. Wafer polishing apparatus

Also Published As

Publication number Publication date
GB0222814D0 (en) 2002-11-06
GB2380960A (en) 2003-04-23
GB2380700A (en) 2003-04-16
GB2380960B (en) 2003-06-04
GB0222815D0 (en) 2002-11-06

Similar Documents

Publication Publication Date Title
IL120758A (en) High speed accurate temperature measuring device
HK1043471A1 (en) Apparatus for measuring relative hydration of a substrate
EP0914908A3 (en) Polishing apparatus and method
MY120159A (en) Wafer polishing apparatus
WO1996012159A3 (en) Hand-held gap and contour measuring gauge
TWI264676B (en) Contact sensitive device and method of determining information
DE69909995D1 (en) FINAL DETERMINATION OF CHEMICAL, MECHANICAL POLISHING (CMP) BY DETERMINING THE HEIGHT OF THE SUBSTRATE HOLDER
EP1060835A3 (en) Method and apparatus for controlling flatness of polished semiconductor wafers
GB2347102B (en) Wafer polishing apparatus and polishing quantity detection method
GB2380700B (en) Wafer polishing apparatus
MY116991A (en) Calibration apparatus and methods for a thermal proximity sensor
DK0801290T3 (en) Positioning system with pressure measurement in the air layer between measuring head and measuring object
JPS578072A (en) Detection of use limit of grinding wheel of grinder
EP1096122A4 (en) Method for detecting sensor failures and for controlling the operation conditions of an object
EP0671607A3 (en) Position-measuring device.
EP1125101A4 (en) High range sensor for pressure gauge
GB9116115D0 (en) Fibre-optic probe for surface measurement
TW430908B (en) Semiconductor device and method for manufacturing the same
ATE221986T1 (en) MEASURING HEAD HOLDER
CA2290382A1 (en) Apparatus and method for measuring the temperature of a moving surface
GB2133893A (en) Detecting leaks
JPS55156835A (en) Measuring device for viscoelasticity
FR2389128A1 (en) Thermal conductivity measurement probe - has heat source and circular array of semiconducting heat detectors
JPH06249645A (en) Gap sensor
TW351990U (en) Wearing-type sensing apparatus for continuously measuring pressure of sole

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20071015