GB0222815D0 - Wafer polishing apparats and polishing quantity detection method - Google Patents
Wafer polishing apparats and polishing quantity detection methodInfo
- Publication number
- GB0222815D0 GB0222815D0 GBGB0222815.3A GB0222815A GB0222815D0 GB 0222815 D0 GB0222815 D0 GB 0222815D0 GB 0222815 A GB0222815 A GB 0222815A GB 0222815 D0 GB0222815 D0 GB 0222815D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- polishing
- wafer
- detector
- temperature
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Wafer polishing apparatus comprises a rotatable polishing platen which carries a polishing cloth, a wafer carrier 412 and a pad 611 and 612 arranged around a wafer which contacts the cloth at a predetermined pressure. The apparatus also comprises a detector 51 and 52 which measures the position of the pad relative to the back of the wafer or the wafer carrier 412. A temperature sensor 72 measures the temperature in the neighbourhood of the detector 51 and 52. The amount of polishing performed is calculated based on the signal from the detector 51 and 52 corrected by the measured temperature. The amount of polishing may also be corrected using measurements from temperature sensors 73 and 74 lying between the detector 51 and 52 and the back of the wafer and between the detector 51 and 52 and the portion of the pad 612 facing the polishing cloth. The temperature sensors 72-74 compensate for the different amounts of thermal expansion experienced by the apparatus during polishing.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29575598A JP3082850B2 (en) | 1998-10-16 | 1998-10-16 | Wafer polishing equipment |
JP29571998A JP3045232B2 (en) | 1998-10-16 | 1998-10-16 | Wafer polishing apparatus and polishing amount detection method |
GB0014585A GB2347102B (en) | 1998-10-16 | 1999-10-15 | Wafer polishing apparatus and polishing quantity detection method |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0222815D0 true GB0222815D0 (en) | 2002-11-06 |
GB2380960A GB2380960A (en) | 2003-04-23 |
GB2380960B GB2380960B (en) | 2003-06-04 |
Family
ID=27255763
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0222815A Expired - Fee Related GB2380960B (en) | 1998-10-16 | 1999-10-15 | Wafer polishing apparatus |
GB0222814A Expired - Fee Related GB2380700B (en) | 1998-10-16 | 1999-10-15 | Wafer polishing apparatus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0222814A Expired - Fee Related GB2380700B (en) | 1998-10-16 | 1999-10-15 | Wafer polishing apparatus |
Country Status (1)
Country | Link |
---|---|
GB (2) | GB2380960B (en) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5775777A (en) * | 1980-10-28 | 1982-05-12 | Supiide Fuamu Kk | Polishing machine |
JPS63256360A (en) * | 1987-04-10 | 1988-10-24 | Sumitomo Electric Ind Ltd | Measuring device for dimension in grinding |
JPS6445568A (en) * | 1987-08-11 | 1989-02-20 | Mitsubishi Metal Corp | Automatic dimensioning of lapping machine |
JPH08288245A (en) * | 1995-04-12 | 1996-11-01 | Sony Corp | Polishing apparatus and method |
EP0806266A3 (en) * | 1996-05-09 | 1998-12-09 | Canon Kabushiki Kaisha | Polishing method and polishing apparatus using the same |
JPH10329014A (en) * | 1997-05-26 | 1998-12-15 | Tokyo Seimitsu Co Ltd | Wafer polishing device attached with heat insulating mechanism |
EP0890416A3 (en) * | 1997-07-11 | 2002-09-11 | Tokyo Seimitsu Co.,Ltd. | Wafer polishing apparatus |
-
1999
- 1999-10-15 GB GB0222815A patent/GB2380960B/en not_active Expired - Fee Related
- 1999-10-15 GB GB0222814A patent/GB2380700B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2380700B (en) | 2003-05-28 |
GB2380960A (en) | 2003-04-23 |
GB2380700A (en) | 2003-04-16 |
GB2380960B (en) | 2003-06-04 |
GB0222814D0 (en) | 2002-11-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0902464A3 (en) | Semiconductor wafer temperature measurement and control thereof using gas temperature measurement | |
IL120758A (en) | High speed accurate temperature measuring device | |
HK1043471A1 (en) | Apparatus for measuring relative hydration of a substrate | |
EP0914908A3 (en) | Polishing apparatus and method | |
MY120159A (en) | Wafer polishing apparatus | |
TWI264676B (en) | Contact sensitive device and method of determining information | |
CA2356337A1 (en) | Web caliper measuring system | |
EP0387906A3 (en) | Sensor having a cantilever | |
DE69909995D1 (en) | FINAL DETERMINATION OF CHEMICAL, MECHANICAL POLISHING (CMP) BY DETERMINING THE HEIGHT OF THE SUBSTRATE HOLDER | |
WO1996012159A3 (en) | Hand-held gap and contour measuring gauge | |
EP1014437A3 (en) | In-situ measurement method and apparatus for semiconductor processing | |
HK1022050A1 (en) | Die bonding apparatus | |
GB2347102B (en) | Wafer polishing apparatus and polishing quantity detection method | |
TW374050B (en) | Method and apparatus for modeling substrate reflectivity during chemical mechanical polishing | |
EP1060835A3 (en) | Method and apparatus for controlling flatness of polished semiconductor wafers | |
AU4762900A (en) | Method for detecting scaling in a coffee maker | |
FR2796143B1 (en) | DEVICE FOR EVALUATING THE GEOMETRY OF ARTICLES TRANSPORTED BY A CONVEYOR | |
MY116991A (en) | Calibration apparatus and methods for a thermal proximity sensor | |
GB0222815D0 (en) | Wafer polishing apparats and polishing quantity detection method | |
JPS578072A (en) | Detection of use limit of grinding wheel of grinder | |
DK0801290T3 (en) | Positioning system with pressure measurement in the air layer between measuring head and measuring object | |
EP1096122A4 (en) | Method for detecting sensor failures and for controlling the operation conditions of an object | |
ATE171272T1 (en) | METHOD AND DEVICE FOR ADJUSTING A MEASURING BODY OF A MEASUREMENT TRANSDUCER | |
GB2133893A (en) | Detecting leaks | |
CA2290382A1 (en) | Apparatus and method for measuring the temperature of a moving surface |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20071015 |