JPS5769748A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5769748A
JPS5769748A JP14546480A JP14546480A JPS5769748A JP S5769748 A JPS5769748 A JP S5769748A JP 14546480 A JP14546480 A JP 14546480A JP 14546480 A JP14546480 A JP 14546480A JP S5769748 A JPS5769748 A JP S5769748A
Authority
JP
Japan
Prior art keywords
film
shortcircuit
disconnection
glass
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14546480A
Other languages
Japanese (ja)
Inventor
Ichiro Fujita
Osamu Hataishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14546480A priority Critical patent/JPS5769748A/en
Publication of JPS5769748A publication Critical patent/JPS5769748A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76819—Smoothing of the dielectric

Abstract

PURPOSE:To prevent the disconnection and shortcircuit of a semiconductor device by thermally setting a film without heating a metallic wire under the film to the film as an interlayer insulating film formed by spincoating glass or chemical liquid phase growth by energy beam emitted. CONSTITUTION:An aluminum wire 3 is patterned on an SiO2 film 2 on an Si substrate 1. A PSG film 4 is covered thereon. Then, a film (CLD film) 5 by a chemical liquid phase growth or spincoat glass is formed, and carbon dioxide gas laser of wavelength of 10.5mum is emitted to the overall surface. The surface is thermally set by this emission, but the heat does not reach the lower layer. Thus, the respective layers in the multilayer structure of the IC can be flattened to prevent the disconnection and shortcircuit.
JP14546480A 1980-10-17 1980-10-17 Manufacture of semiconductor device Pending JPS5769748A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14546480A JPS5769748A (en) 1980-10-17 1980-10-17 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14546480A JPS5769748A (en) 1980-10-17 1980-10-17 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5769748A true JPS5769748A (en) 1982-04-28

Family

ID=15385837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14546480A Pending JPS5769748A (en) 1980-10-17 1980-10-17 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5769748A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5249311A (en) * 1975-10-20 1977-04-20 Midori Kurasawa Dyeing method of creped paper
JPS5280779A (en) * 1975-12-27 1977-07-06 Fujitsu Ltd Production of simiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5249311A (en) * 1975-10-20 1977-04-20 Midori Kurasawa Dyeing method of creped paper
JPS5280779A (en) * 1975-12-27 1977-07-06 Fujitsu Ltd Production of simiconductor device

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