JPS5765722A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5765722A JPS5765722A JP14231580A JP14231580A JPS5765722A JP S5765722 A JPS5765722 A JP S5765722A JP 14231580 A JP14231580 A JP 14231580A JP 14231580 A JP14231580 A JP 14231580A JP S5765722 A JPS5765722 A JP S5765722A
- Authority
- JP
- Japan
- Prior art keywords
- group
- formula
- organotin compound
- compound
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title abstract 4
- 239000003822 epoxy resin Substances 0.000 title abstract 2
- 229920000647 polyepoxide Polymers 0.000 title abstract 2
- -1 aluminate ester Chemical class 0.000 abstract 4
- 150000001875 compounds Chemical class 0.000 abstract 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 abstract 4
- 125000003545 alkoxy group Chemical group 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229910000077 silane Inorganic materials 0.000 abstract 2
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 150000007524 organic acids Chemical group 0.000 abstract 1
- 125000000962 organic group Chemical group 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14231580A JPS5765722A (en) | 1980-10-11 | 1980-10-11 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14231580A JPS5765722A (en) | 1980-10-11 | 1980-10-11 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5765722A true JPS5765722A (en) | 1982-04-21 |
| JPH0140046B2 JPH0140046B2 (enrdf_load_stackoverflow) | 1989-08-24 |
Family
ID=15312488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14231580A Granted JPS5765722A (en) | 1980-10-11 | 1980-10-11 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5765722A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995035336A1 (fr) * | 1994-06-17 | 1995-12-28 | Kansai Paint Company, Limited | Composition thermodurcissable et procede de constitution d'une pellicule de finition |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56160054A (en) * | 1980-05-15 | 1981-12-09 | Toshiba Corp | Resin sealing type semiconductor device |
-
1980
- 1980-10-11 JP JP14231580A patent/JPS5765722A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56160054A (en) * | 1980-05-15 | 1981-12-09 | Toshiba Corp | Resin sealing type semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995035336A1 (fr) * | 1994-06-17 | 1995-12-28 | Kansai Paint Company, Limited | Composition thermodurcissable et procede de constitution d'une pellicule de finition |
| US5821314A (en) * | 1994-06-17 | 1998-10-13 | Kansai Paint Company, Limited | Thermosetting compositions and methods of forming a finish coat |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0140046B2 (enrdf_load_stackoverflow) | 1989-08-24 |
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