JPH0140046B2 - - Google Patents

Info

Publication number
JPH0140046B2
JPH0140046B2 JP55142315A JP14231580A JPH0140046B2 JP H0140046 B2 JPH0140046 B2 JP H0140046B2 JP 55142315 A JP55142315 A JP 55142315A JP 14231580 A JP14231580 A JP 14231580A JP H0140046 B2 JPH0140046 B2 JP H0140046B2
Authority
JP
Japan
Prior art keywords
group
general formula
epoxy resin
formula
above formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55142315A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5765722A (en
Inventor
Masaaki Ootsu
Masahiro Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP14231580A priority Critical patent/JPS5765722A/ja
Publication of JPS5765722A publication Critical patent/JPS5765722A/ja
Publication of JPH0140046B2 publication Critical patent/JPH0140046B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP14231580A 1980-10-11 1980-10-11 Epoxy resin composition Granted JPS5765722A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14231580A JPS5765722A (en) 1980-10-11 1980-10-11 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14231580A JPS5765722A (en) 1980-10-11 1980-10-11 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS5765722A JPS5765722A (en) 1982-04-21
JPH0140046B2 true JPH0140046B2 (enrdf_load_stackoverflow) 1989-08-24

Family

ID=15312488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14231580A Granted JPS5765722A (en) 1980-10-11 1980-10-11 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5765722A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995035336A1 (fr) * 1994-06-17 1995-12-28 Kansai Paint Company, Limited Composition thermodurcissable et procede de constitution d'une pellicule de finition

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56160054A (en) * 1980-05-15 1981-12-09 Toshiba Corp Resin sealing type semiconductor device

Also Published As

Publication number Publication date
JPS5765722A (en) 1982-04-21

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