JPS57139117A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS57139117A
JPS57139117A JP2470381A JP2470381A JPS57139117A JP S57139117 A JPS57139117 A JP S57139117A JP 2470381 A JP2470381 A JP 2470381A JP 2470381 A JP2470381 A JP 2470381A JP S57139117 A JPS57139117 A JP S57139117A
Authority
JP
Japan
Prior art keywords
group
resin composition
alkyl
epoxy resin
organic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2470381A
Other languages
Japanese (ja)
Inventor
Masaaki Otsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP2470381A priority Critical patent/JPS57139117A/en
Publication of JPS57139117A publication Critical patent/JPS57139117A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: The titled resin composition excellent in low-pressure fluidity, quick curability, etc., and suitable for sealing semiconductor devices, prepared by mixing at least one member selected from the group consisting of tin salts of an organic acid, an aluminate ester and an alkoxy group-containing silane compound.
CONSTITUTION: To an epoxy resin are added a resorcinol resin as a curing agent and a tert. amine (e.g., dicyanidiamide) as a curing acid. Then, the purpose resin composition is prepared by further mixing the above mixture with 0.01W 1pt.wt. per 100pts.wt. epoxy resin, at least one compound selected from the group consisting of (A) Sn salts of an organic acid represented by formulasI, II and III, wherein R is a monovalent organic group, R' is an organic acid residue and n is 1W5, (B) an aluminate ester represented by formula IV, wherein R is an alkyl or an aryl and n is 1W5, and (C) an alkoxy group-containing silane compound represented by formula V, wherein R is an alkyl, R' is an alkyl or an aryl and n is 0W3.
COPYRIGHT: (C)1982,JPO&Japio
JP2470381A 1981-02-21 1981-02-21 Epoxy resin composition Pending JPS57139117A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2470381A JPS57139117A (en) 1981-02-21 1981-02-21 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2470381A JPS57139117A (en) 1981-02-21 1981-02-21 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS57139117A true JPS57139117A (en) 1982-08-27

Family

ID=12145533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2470381A Pending JPS57139117A (en) 1981-02-21 1981-02-21 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS57139117A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6469677A (en) * 1987-09-09 1989-03-15 Sankyo Organic Chemicals Co Curing catalyst for cationic electrodeposition paint
JPH0384058A (en) * 1989-08-28 1991-04-09 Sekisui Chem Co Ltd Thixotropic epoxy resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6469677A (en) * 1987-09-09 1989-03-15 Sankyo Organic Chemicals Co Curing catalyst for cationic electrodeposition paint
JPH0384058A (en) * 1989-08-28 1991-04-09 Sekisui Chem Co Ltd Thixotropic epoxy resin composition

Similar Documents

Publication Publication Date Title
JPS57159865A (en) Primer composition for bonding
JPS56103264A (en) Silicone compositin for adhesive
JPS57168942A (en) Photosensitive polymer composition
MY107113A (en) Epoxy resin composition for semiconductor sealing.
JPS5562963A (en) Photo-setting organopolysiloxane composition
JPS54157149A (en) Rubber composition
TW344753B (en) Curable electroconductive composition
JPS6465116A (en) Resin composition for semiconductor sealing
DE59602725D1 (en) EPOXY RESIN MOLDS WITH HALOGEN-FREE FLAME PROTECTION
JPS57139117A (en) Epoxy resin composition
JPS5529532A (en) Epoxy resin composition
JPS5426000A (en) Epoxy resin composition
JPS57159813A (en) Epoxy resin composition
JPS5681333A (en) Epoxy resin composition
JPS57155250A (en) Curable composition
JPS57172925A (en) High-filling of organic polymer with inorganic filler
ES8403942A1 (en) Curable compositions and process for preparing a cured composition.
JPS57135823A (en) Polyol composition
JPS5665024A (en) Curable resin composition
JPS5467000A (en) Transparent thermosetting resin composition
JPS5765722A (en) Epoxy resin composition
JPS5523128A (en) Vulcanizable composition of mixed elastomers
JPS5454199A (en) Epoxy resin composition
JPS5749654A (en) Polyurethane composition
JPS5590554A (en) Silicone-epoxy resin composition