JPS5760090A - Supplying method for palladium to palladium-nickel alloy plating solution - Google Patents

Supplying method for palladium to palladium-nickel alloy plating solution

Info

Publication number
JPS5760090A
JPS5760090A JP55135623A JP13562380A JPS5760090A JP S5760090 A JPS5760090 A JP S5760090A JP 55135623 A JP55135623 A JP 55135623A JP 13562380 A JP13562380 A JP 13562380A JP S5760090 A JPS5760090 A JP S5760090A
Authority
JP
Japan
Prior art keywords
soln
plating
palladium
crystalline
aqueous ammonia
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55135623A
Other languages
English (en)
Japanese (ja)
Inventor
Hirotomo Koshiro
Masao Kanai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NITSUSHIN KASEI KK
Nisshin Kasei KK
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
NITSUSHIN KASEI KK
Nisshin Kasei KK
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NITSUSHIN KASEI KK, Nisshin Kasei KK, Seiko Epson Corp, Suwa Seikosha KK filed Critical NITSUSHIN KASEI KK
Priority to JP55135623A priority Critical patent/JPS5760090A/ja
Priority to IT49097/81A priority patent/IT1171457B/it
Priority to GB8126690A priority patent/GB2084192B/en
Priority to DE3135597A priority patent/DE3135597C2/de
Priority to FR8117487A priority patent/FR2491093B1/fr
Priority to CH6108/81A priority patent/CH647270A5/de
Publication of JPS5760090A publication Critical patent/JPS5760090A/ja
Priority to SG22485A priority patent/SG22485G/en
Priority to HK57485A priority patent/HK57485A/xx
Priority to MY8700009A priority patent/MY8700009A/xx
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
JP55135623A 1980-09-19 1980-09-29 Supplying method for palladium to palladium-nickel alloy plating solution Pending JPS5760090A (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP55135623A JPS5760090A (en) 1980-09-29 1980-09-29 Supplying method for palladium to palladium-nickel alloy plating solution
IT49097/81A IT1171457B (it) 1980-09-29 1981-08-12 Metodo per rifornire di palladio una soluzione di placcatura con lega palladio/nichel
GB8126690A GB2084192B (en) 1980-09-19 1981-09-03 A method of making a plating solution for electrodeposition of a palladium-nickel alloy
DE3135597A DE3135597C2 (de) 1980-09-29 1981-09-09 Verfahren zur Auffrischung einer Palladium/Nickel-Legierung-Plattierungslösung mit Palladium
FR8117487A FR2491093B1 (fr) 1980-09-29 1981-09-16 Procede pour recharger en palladium une solution de depot d'un alliage de palladium et de nickel
CH6108/81A CH647270A5 (de) 1980-09-29 1981-09-22 Verfahren zur ergaenzung eines bades fuer die elektrolytische plattierung mit einer palladium/nickel-legierung mit palladium.
SG22485A SG22485G (en) 1980-09-19 1985-03-26 A method of replenishing with palladium a plating solution for electrodeposition of a palladium-nickel alloy
HK57485A HK57485A (en) 1980-09-19 1985-08-01 A method of replenishing with palladium a plating solution for electrodeposition of a palladium-nickel alloy
MY8700009A MY8700009A (en) 1980-09-19 1987-12-30 A method of replenishing with palladium a plating solution for electrodeposition of a palladium-nickel alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55135623A JPS5760090A (en) 1980-09-29 1980-09-29 Supplying method for palladium to palladium-nickel alloy plating solution

Publications (1)

Publication Number Publication Date
JPS5760090A true JPS5760090A (en) 1982-04-10

Family

ID=15156128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55135623A Pending JPS5760090A (en) 1980-09-19 1980-09-29 Supplying method for palladium to palladium-nickel alloy plating solution

Country Status (5)

Country Link
JP (1) JPS5760090A (it)
CH (1) CH647270A5 (it)
DE (1) DE3135597C2 (it)
FR (1) FR2491093B1 (it)
IT (1) IT1171457B (it)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6192731A (ja) * 1984-10-12 1986-05-10 Masanobu Nakamura 溝付き回転体の製造方法
US4699697A (en) * 1984-05-24 1987-10-13 Electroplating Engineers Of Japan, Limited High-purity palladium-nickel alloy plating solution and process
JPH02133595A (ja) * 1988-11-15 1990-05-22 Fujitsu Ltd パラジウムめっき方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB381931A (en) * 1931-07-11 1932-10-11 Mond Nickel Co Ltd Improvements relating to electro-plating and the electrodeposition of metals
JPS4733176B1 (it) * 1967-01-11 1972-08-23
CH572989A5 (it) * 1973-04-27 1976-02-27 Oxy Metal Industries Corp

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4699697A (en) * 1984-05-24 1987-10-13 Electroplating Engineers Of Japan, Limited High-purity palladium-nickel alloy plating solution and process
JPS6192731A (ja) * 1984-10-12 1986-05-10 Masanobu Nakamura 溝付き回転体の製造方法
JPH02133595A (ja) * 1988-11-15 1990-05-22 Fujitsu Ltd パラジウムめっき方法

Also Published As

Publication number Publication date
DE3135597C2 (de) 1986-02-13
IT8149097A0 (it) 1981-08-12
IT1171457B (it) 1987-06-10
DE3135597A1 (de) 1982-05-13
CH647270A5 (de) 1985-01-15
FR2491093B1 (fr) 1985-11-15
FR2491093A1 (fr) 1982-04-02

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