IT8149097A0 - Metodo per rifornire di palladio una soluzione di placcatura con lega palladio/nichel - Google Patents
Metodo per rifornire di palladio una soluzione di placcatura con lega palladio/nichelInfo
- Publication number
- IT8149097A0 IT8149097A0 IT8149097A IT4909781A IT8149097A0 IT 8149097 A0 IT8149097 A0 IT 8149097A0 IT 8149097 A IT8149097 A IT 8149097A IT 4909781 A IT4909781 A IT 4909781A IT 8149097 A0 IT8149097 A0 IT 8149097A0
- Authority
- IT
- Italy
- Prior art keywords
- palladium
- plating solution
- supplying
- nickel alloy
- alloy plating
- Prior art date
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title 4
- 229910000990 Ni alloy Inorganic materials 0.000 title 1
- 229910001252 Pd alloy Inorganic materials 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 229910052763 palladium Inorganic materials 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55135623A JPS5760090A (en) | 1980-09-29 | 1980-09-29 | Supplying method for palladium to palladium-nickel alloy plating solution |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8149097A0 true IT8149097A0 (it) | 1981-08-12 |
IT1171457B IT1171457B (it) | 1987-06-10 |
Family
ID=15156128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT49097/81A IT1171457B (it) | 1980-09-29 | 1981-08-12 | Metodo per rifornire di palladio una soluzione di placcatura con lega palladio/nichel |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5760090A (it) |
CH (1) | CH647270A5 (it) |
DE (1) | DE3135597C2 (it) |
FR (1) | FR2491093B1 (it) |
IT (1) | IT1171457B (it) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60248892A (ja) * | 1984-05-24 | 1985-12-09 | Electroplating Eng Of Japan Co | 高純度パラジウム・ニッケル合金メッキ液及び方法 |
JPS6192731A (ja) * | 1984-10-12 | 1986-05-10 | Masanobu Nakamura | 溝付き回転体の製造方法 |
JPH02133595A (ja) * | 1988-11-15 | 1990-05-22 | Fujitsu Ltd | パラジウムめっき方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB381931A (en) * | 1931-07-11 | 1932-10-11 | Mond Nickel Co Ltd | Improvements relating to electro-plating and the electrodeposition of metals |
JPS4733176B1 (it) * | 1967-01-11 | 1972-08-23 | ||
CH572989A5 (it) * | 1973-04-27 | 1976-02-27 | Oxy Metal Industries Corp |
-
1980
- 1980-09-29 JP JP55135623A patent/JPS5760090A/ja active Pending
-
1981
- 1981-08-12 IT IT49097/81A patent/IT1171457B/it active
- 1981-09-09 DE DE3135597A patent/DE3135597C2/de not_active Expired
- 1981-09-16 FR FR8117487A patent/FR2491093B1/fr not_active Expired
- 1981-09-22 CH CH6108/81A patent/CH647270A5/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
FR2491093B1 (fr) | 1985-11-15 |
JPS5760090A (en) | 1982-04-10 |
IT1171457B (it) | 1987-06-10 |
DE3135597C2 (de) | 1986-02-13 |
FR2491093A1 (fr) | 1982-04-02 |
CH647270A5 (de) | 1985-01-15 |
DE3135597A1 (de) | 1982-05-13 |
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