JPS575055B2 - - Google Patents

Info

Publication number
JPS575055B2
JPS575055B2 JP833677A JP833677A JPS575055B2 JP S575055 B2 JPS575055 B2 JP S575055B2 JP 833677 A JP833677 A JP 833677A JP 833677 A JP833677 A JP 833677A JP S575055 B2 JPS575055 B2 JP S575055B2
Authority
JP
Japan
Prior art keywords
elements
solder
semiconductor
reliablity
stems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP833677A
Other languages
English (en)
Other versions
JPS5393780A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP833677A priority Critical patent/JPS5393780A/ja
Publication of JPS5393780A publication Critical patent/JPS5393780A/ja
Publication of JPS575055B2 publication Critical patent/JPS575055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83192Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92Specific sequence of method steps
    • H01L2224/922Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222Sequential connecting processes
    • H01L2224/92242Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

Landscapes

  • Die Bonding (AREA)
JP833677A 1977-01-27 1977-01-27 Production of semiconductor device Granted JPS5393780A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP833677A JPS5393780A (en) 1977-01-27 1977-01-27 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP833677A JPS5393780A (en) 1977-01-27 1977-01-27 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5393780A JPS5393780A (en) 1978-08-17
JPS575055B2 true JPS575055B2 (ja) 1982-01-28

Family

ID=11690341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP833677A Granted JPS5393780A (en) 1977-01-27 1977-01-27 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5393780A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS622652U (ja) * 1985-06-20 1987-01-09

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758719B2 (ja) * 1989-03-17 1995-06-21 サンケン電気株式会社 電子素子の固着方法
JPH0758720B2 (ja) * 1989-03-17 1995-06-21 サンケン電気株式会社 電子素子の固着方法
US5601493A (en) * 1992-10-22 1997-02-11 Sumitomo Chemical Company Limited Drive shaft made of fiber reinforced plastics, and method for connecting pipe made of fire-reinforced plastics

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS622652U (ja) * 1985-06-20 1987-01-09

Also Published As

Publication number Publication date
JPS5393780A (en) 1978-08-17

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