JPS5747266B2 - - Google Patents

Info

Publication number
JPS5747266B2
JPS5747266B2 JP49005001A JP500174A JPS5747266B2 JP S5747266 B2 JPS5747266 B2 JP S5747266B2 JP 49005001 A JP49005001 A JP 49005001A JP 500174 A JP500174 A JP 500174A JP S5747266 B2 JPS5747266 B2 JP S5747266B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49005001A
Other versions
JPS49101273A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS49101273A publication Critical patent/JPS49101273A/ja
Priority to DE19742461033 priority Critical patent/DE2461033A1/de
Priority to ES1974208934U priority patent/ES208934Y/es
Priority to FR7443012A priority patent/FR2255858B1/fr
Priority to NL7416919A priority patent/NL7416919A/xx
Priority to US05/536,999 priority patent/US3984901A/en
Priority to BE151986A priority patent/BE823921A/xx
Priority to GB5598474A priority patent/GB1463628A/en
Priority to IT7078474A priority patent/IT1027202B/it
Priority to BR10978/74A priority patent/BR7410978D0/pt
Priority to AU77056/74A priority patent/AU492450B2/en
Publication of JPS5747266B2 publication Critical patent/JPS5747266B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/3277—Continuous moving of continuous material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP49005001A 1973-01-12 1974-01-07 Expired JPS5747266B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
DE19742461033 DE2461033A1 (de) 1974-01-07 1974-12-23 Reissverschluss
ES1974208934U ES208934Y (es) 1974-01-07 1974-12-24 Cinta de cierre de cremallera.
BE151986A BE823921A (fr) 1974-01-07 1974-12-27 Ruban de support pour fermeture a curseur avec un element de couplage continu en zig-zag
US05/536,999 US3984901A (en) 1973-12-28 1974-12-27 Slide fastener stringer with a zigzag-shaped continuous coupling element
NL7416919A NL7416919A (nl) 1974-01-07 1974-12-27 Ritssluitingband.
FR7443012A FR2255858B1 (ja) 1974-01-07 1974-12-27
GB5598474A GB1463628A (en) 1974-01-07 1974-12-30 Sliding clasp fastener stringer with a zigzag-shaped continuous coupling element
IT7078474A IT1027202B (it) 1974-01-07 1974-12-30 Nastro di cerniera lampo con elemento continuo di accoppiamento formato a zig zag
BR10978/74A BR7410978D0 (pt) 1974-01-07 1974-12-30 Fecho deslizante com elemento de acoplamento continuo em formato zigue-zague
AU77056/74A AU492450B2 (en) 1974-12-31 Sliding clasp fastener

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00322968A US3829373A (en) 1973-01-12 1973-01-12 Thin film deposition apparatus using segmented target means

Publications (2)

Publication Number Publication Date
JPS49101273A JPS49101273A (ja) 1974-09-25
JPS5747266B2 true JPS5747266B2 (ja) 1982-10-08

Family

ID=23257231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49005001A Expired JPS5747266B2 (ja) 1973-01-12 1974-01-07

Country Status (9)

Country Link
US (1) US3829373A (ja)
JP (1) JPS5747266B2 (ja)
BE (1) BE809466A (ja)
CA (1) CA1016496A (ja)
CH (1) CH588565A5 (ja)
DE (1) DE2400510C2 (ja)
FR (1) FR2322666A1 (ja)
GB (1) GB1462241A (ja)
NL (1) NL180604C (ja)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3901784A (en) * 1973-11-15 1975-08-26 United Aircraft Corp Cylindrical rf sputtering apparatus
US4026787A (en) * 1974-01-25 1977-05-31 Coulter Information Systems, Inc. Thin film deposition apparatus using segmented target means
US4166018A (en) * 1974-01-31 1979-08-28 Airco, Inc. Sputtering process and apparatus
US3904503A (en) * 1974-05-31 1975-09-09 Western Electric Co Depositing material on a substrate using a shield
JPS5252133A (en) * 1975-07-11 1977-04-26 Tokuda Seisakusho Continuous film coating apparatus
MX145314A (es) * 1975-12-17 1982-01-27 Coulter Systems Corp Mejoras a un aparato chisporroteador para producir pelicula electrofotografica
US4137142A (en) * 1977-12-27 1979-01-30 Stork Brabant B.V. Method and apparatus for sputtering photoconductive coating on endless flexible belts or cylinders
US4151064A (en) * 1977-12-27 1979-04-24 Coulter Stork U.S.A., Inc. Apparatus for sputtering cylinders
DE2845401C2 (de) * 1978-10-18 1980-10-02 Gao Gesellschaft Fuer Automation Und Organisation Mbh, 8000 Muenchen Bedrucktes Wertpapier mit Echtheitsmerkmalen und Verfahren zur Prüfung seineT Echtheit
JPS55100980A (en) * 1979-01-23 1980-08-01 Coulter Systems Corp Sputtering device
US4455039A (en) * 1979-10-16 1984-06-19 Coulter Systems Corporation Encoded security document
US4305801A (en) * 1980-04-16 1981-12-15 The United States Of America As Represented By The United States Department Of Energy Line-of-sight deposition method
US4457825A (en) * 1980-05-16 1984-07-03 Varian Associates, Inc. Sputter target for use in a sputter coating source
US4673480A (en) * 1980-05-16 1987-06-16 Varian Associates, Inc. Magnetically enhanced sputter source
GB2119817A (en) * 1982-05-12 1983-11-23 Dowty Electronics Ltd Vacuum deposition apparatus
CA1193227A (en) * 1982-11-18 1985-09-10 Kovilvila Ramachandran Magnetron sputtering apparatus
US4443318A (en) * 1983-08-17 1984-04-17 Shatterproof Glass Corporation Cathodic sputtering apparatus
GB8332394D0 (en) * 1983-12-05 1984-01-11 Pilkington Brothers Plc Coating apparatus
US4491509A (en) * 1984-03-09 1985-01-01 At&T Technologies, Inc. Methods of and apparatus for sputtering material onto a substrate
US4560462A (en) * 1984-06-22 1985-12-24 Westinghouse Electric Corp. Apparatus for coating nuclear fuel pellets with a burnable absorber
DE3628950A1 (de) * 1986-08-26 1988-03-03 Grundig Emv Verfahren zur herstellung eines magnetkopfes
US5225057A (en) * 1988-02-08 1993-07-06 Optical Coating Laboratory, Inc. Process for depositing optical films on both planar and non-planar substrates
US5618388A (en) * 1988-02-08 1997-04-08 Optical Coating Laboratory, Inc. Geometries and configurations for magnetron sputtering apparatus
US5798027A (en) * 1988-02-08 1998-08-25 Optical Coating Laboratory, Inc. Process for depositing optical thin films on both planar and non-planar substrates
US4851095A (en) * 1988-02-08 1989-07-25 Optical Coating Laboratory, Inc. Magnetron sputtering apparatus and process
US4879017A (en) * 1988-11-29 1989-11-07 Dae Ryung Vacumm Co. Ltd. Multi-rod type magnetron sputtering apparatus
US6024843A (en) * 1989-05-22 2000-02-15 Novellus Systems, Inc. Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
WO1991020091A1 (en) * 1990-06-16 1991-12-26 General Vacuum Equipment Limited Metallizing apparatus
US5262032A (en) * 1991-05-28 1993-11-16 Leybold Aktiengesellschaft Sputtering apparatus with rotating target and target cooling
FR2689143B1 (fr) * 1992-03-31 1994-05-13 Commissariat A Energie Atomique Dispositif de pulverisation cathodique utilisant un plasma engendre par des micro-ondes.
US6217716B1 (en) 1998-05-06 2001-04-17 Novellus Systems, Inc. Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
JP2924891B1 (ja) * 1998-05-15 1999-07-26 日本電気株式会社 スパッタリング装置
US6495010B2 (en) 2000-07-10 2002-12-17 Unaxis Usa, Inc. Differentially-pumped material processing system
US6669824B2 (en) 2000-07-10 2003-12-30 Unaxis Usa, Inc. Dual-scan thin film processing system
DE10202311B4 (de) * 2002-01-23 2007-01-04 Schott Ag Vorrichtung und Verfahren zur Plasmabehandlung von dielektrischen Körpern
US6906008B2 (en) * 2003-06-26 2005-06-14 Superpower, Inc. Apparatus for consecutive deposition of high-temperature superconducting (HTS) buffer layers
US7169232B2 (en) * 2004-06-01 2007-01-30 Eastman Kodak Company Producing repetitive coatings on a flexible substrate
US7601246B2 (en) * 2004-09-29 2009-10-13 Lam Research Corporation Methods of sputtering a protective coating on a semiconductor substrate
KR20140106753A (ko) * 2012-01-16 2014-09-03 울박, 인크 성막 장치
EP2855729B1 (en) * 2012-05-29 2019-05-08 Applied Materials, Inc. Method for coating a substrate and coater
JP5868309B2 (ja) * 2012-12-21 2016-02-24 株式会社神戸製鋼所 基材搬送ロール
ES2937385T3 (es) * 2017-06-22 2023-03-28 Bobst Manchester Ltd Máquina de PEPVD
GB2588939B (en) * 2019-11-15 2022-12-28 Dyson Technology Ltd Sputter deposition apparatus and method
GB2588935B (en) * 2019-11-15 2022-09-07 Dyson Technology Ltd Method and apparatus for sputter deposition of target material to a substrate
GB2588941B (en) * 2019-11-15 2022-08-17 Dyson Technology Ltd Method of depositing a material
GB2588934B (en) * 2019-11-15 2024-08-28 Dyson Technology Ltd Sputter deposition
GB2588942B (en) * 2019-11-15 2024-07-24 Dyson Technology Ltd Sputter deposition
GB2588949B (en) * 2019-11-15 2022-09-07 Dyson Technology Ltd Method and apparatus for sputter deposition
GB2588938B (en) * 2019-11-15 2024-07-24 Dyson Technology Ltd Sputter deposition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5127246U (ja) * 1974-08-15 1976-02-27

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB367074A (en) * 1930-12-04 1932-02-18 Max Knoll Improvements in and relating to the coating of materials
FR707671A (fr) * 1930-12-04 1931-07-10 Procédé pour l'obtention de revêtements par pulvérisation cathodique
US2925062A (en) * 1953-05-15 1960-02-16 Heraeus Gmbh W C Coating apparatus
GB1284224A (en) * 1968-12-12 1972-08-02 Edwards High Vacuum Int Ltd Radio frequency sputtering apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5127246U (ja) * 1974-08-15 1976-02-27

Also Published As

Publication number Publication date
CH588565A5 (ja) 1977-06-15
US3829373A (en) 1974-08-13
DE2400510C2 (de) 1985-05-23
FR2322666B1 (ja) 1979-01-26
DE2400510A1 (de) 1974-07-18
BE809466A (fr) 1974-07-08
NL7400145A (ja) 1974-07-16
NL180604C (nl) 1987-03-16
FR2322666A1 (fr) 1977-04-01
NL180604B (nl) 1986-10-16
GB1462241A (en) 1977-01-19
JPS49101273A (ja) 1974-09-25
CA1016496A (en) 1977-08-30

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