JPS573821A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS573821A JPS573821A JP7779880A JP7779880A JPS573821A JP S573821 A JPS573821 A JP S573821A JP 7779880 A JP7779880 A JP 7779880A JP 7779880 A JP7779880 A JP 7779880A JP S573821 A JPS573821 A JP S573821A
- Authority
- JP
- Japan
- Prior art keywords
- reaction product
- polyamine
- dicarboxylic acid
- inorganic filler
- unsaturated dicarboxylic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title abstract 4
- 239000003822 epoxy resin Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
- 150000001875 compounds Chemical class 0.000 abstract 4
- 239000007795 chemical reaction product Substances 0.000 abstract 3
- 239000004593 Epoxy Substances 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 2
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 abstract 2
- 239000011256 inorganic filler Substances 0.000 abstract 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 2
- 229920000768 polyamine Polymers 0.000 abstract 2
- 229920001296 polysiloxane Polymers 0.000 abstract 2
- 150000004984 aromatic diamines Chemical class 0.000 abstract 1
- 239000004927 clay Substances 0.000 abstract 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 abstract 1
- -1 e.g. Substances 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 abstract 1
- 239000000047 product Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7779880A JPS573821A (en) | 1980-06-11 | 1980-06-11 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7779880A JPS573821A (en) | 1980-06-11 | 1980-06-11 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS573821A true JPS573821A (en) | 1982-01-09 |
| JPS621609B2 JPS621609B2 (enrdf_load_stackoverflow) | 1987-01-14 |
Family
ID=13644010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7779880A Granted JPS573821A (en) | 1980-06-11 | 1980-06-11 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS573821A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5876455A (ja) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | 封止用熱硬化性樹脂成形材料及びこれを用いて成形された電子部品 |
| JPH0649363A (ja) * | 1992-08-04 | 1994-02-22 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノポリシロキサン組成物 |
| JPH0770408A (ja) * | 1994-03-16 | 1995-03-14 | Nitto Denko Corp | 半導体装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02200601A (ja) * | 1989-01-30 | 1990-08-08 | Nozawagumi:Kk | 受精卵、精子等の凍結装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5364266A (en) * | 1976-11-22 | 1978-06-08 | Shin Etsu Chem Co Ltd | Epoxy-silicone resin compositions |
| JPS553412A (en) * | 1978-06-21 | 1980-01-11 | Hitachi Ltd | Epoxy resin composition |
| JPS5512124A (en) * | 1978-07-12 | 1980-01-28 | Hitachi Ltd | Thermosetting resin composition |
-
1980
- 1980-06-11 JP JP7779880A patent/JPS573821A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5364266A (en) * | 1976-11-22 | 1978-06-08 | Shin Etsu Chem Co Ltd | Epoxy-silicone resin compositions |
| JPS553412A (en) * | 1978-06-21 | 1980-01-11 | Hitachi Ltd | Epoxy resin composition |
| JPS5512124A (en) * | 1978-07-12 | 1980-01-28 | Hitachi Ltd | Thermosetting resin composition |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5876455A (ja) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | 封止用熱硬化性樹脂成形材料及びこれを用いて成形された電子部品 |
| JPH0649363A (ja) * | 1992-08-04 | 1994-02-22 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノポリシロキサン組成物 |
| JPH0770408A (ja) * | 1994-03-16 | 1995-03-14 | Nitto Denko Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS621609B2 (enrdf_load_stackoverflow) | 1987-01-14 |
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