JPS5735364A - Thin film hybrid integrated circuit - Google Patents

Thin film hybrid integrated circuit

Info

Publication number
JPS5735364A
JPS5735364A JP11009580A JP11009580A JPS5735364A JP S5735364 A JPS5735364 A JP S5735364A JP 11009580 A JP11009580 A JP 11009580A JP 11009580 A JP11009580 A JP 11009580A JP S5735364 A JPS5735364 A JP S5735364A
Authority
JP
Japan
Prior art keywords
resistor pattern
width
length
thickness
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11009580A
Other languages
Japanese (ja)
Other versions
JPH0140515B2 (en
Inventor
Shinji Yoshida
Giichi Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11009580A priority Critical patent/JPS5735364A/en
Publication of JPS5735364A publication Critical patent/JPS5735364A/en
Publication of JPH0140515B2 publication Critical patent/JPH0140515B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/016—Thin-film circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE:To obtain a constant resistor pattern formation voltages having various constants, by adjusting one of width, length, and depositing thickness of the resistor pattern. CONSTITUTION:Of the width w, the length l, and the depositing thickness t of the resistor pattern formed by formation trimming means, at least one factor is adjusted, and the resistor pattern formation voltage having various constants are made constant. For example, in the case a Ta-N layer is deposited on a substrate 1 with a uniform thickness t, and the resistor patterns having various shapes are formed by etching, compensation and adjustment are made by increasing or decreasing the width w and the length l of the pattern, and the thickness becomes costant. Thus, the formation voltage v of the resistor pattern becomes constant.
JP11009580A 1980-08-11 1980-08-11 Thin film hybrid integrated circuit Granted JPS5735364A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11009580A JPS5735364A (en) 1980-08-11 1980-08-11 Thin film hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11009580A JPS5735364A (en) 1980-08-11 1980-08-11 Thin film hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPS5735364A true JPS5735364A (en) 1982-02-25
JPH0140515B2 JPH0140515B2 (en) 1989-08-29

Family

ID=14526896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11009580A Granted JPS5735364A (en) 1980-08-11 1980-08-11 Thin film hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS5735364A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989006086A1 (en) * 1987-12-18 1989-06-29 Mitsui Mining & Smelting Co., Ltd. Thin-film conductive circuit and process for its production
JPH05109925A (en) * 1991-10-18 1993-04-30 Kyocera Corp Thin-film wiring board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989006086A1 (en) * 1987-12-18 1989-06-29 Mitsui Mining & Smelting Co., Ltd. Thin-film conductive circuit and process for its production
US5032694A (en) * 1987-12-18 1991-07-16 Mitsui Mining & Smelting Co., Ltd. Conductive film circuit and method of manufacturing the same
JPH05109925A (en) * 1991-10-18 1993-04-30 Kyocera Corp Thin-film wiring board

Also Published As

Publication number Publication date
JPH0140515B2 (en) 1989-08-29

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