JPS57166064A - Capacity adjusting method for thick film hybrid ic - Google Patents

Capacity adjusting method for thick film hybrid ic

Info

Publication number
JPS57166064A
JPS57166064A JP56050637A JP5063781A JPS57166064A JP S57166064 A JPS57166064 A JP S57166064A JP 56050637 A JP56050637 A JP 56050637A JP 5063781 A JP5063781 A JP 5063781A JP S57166064 A JPS57166064 A JP S57166064A
Authority
JP
Japan
Prior art keywords
capacity
thick film
capacity adjusting
patterns
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56050637A
Other languages
Japanese (ja)
Inventor
Hiroshi Otsu
Takao Kobayashi
Koichi Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56050637A priority Critical patent/JPS57166064A/en
Publication of JPS57166064A publication Critical patent/JPS57166064A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/013—Thick-film circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE:To ease capacity adjusting and realize a thick film hybrid IC with a wide range capacity adjustment feature by a method wherein at least the capacity adjusting means in a thick film capacitor is constituted of a pair of patterned resistors which are subjected to trimming. CONSTITUTION:A pair of electrode patterns 7 and 8 is provided on a ceramic substrate 1 and, further, a pair of resistor patterns 9 and 10 is provided composed of an Ru oxide glass to be connected as a capacity adjusting means for a capacitor to the electrode patterns 7 and 8. Next, at least one of the resistor patterns 9 and 10 located opposite to each other are abraded by the sand blast method for the adjustment of the capacity between the two patterns 9 and 10. The parts contributing to capacity adjustment composed of an Ru oxide glass weak in its adhesion to a ceramic substrate, trimming is performed with ease and precision and no migration is expected to run into the substrate.
JP56050637A 1981-04-06 1981-04-06 Capacity adjusting method for thick film hybrid ic Pending JPS57166064A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56050637A JPS57166064A (en) 1981-04-06 1981-04-06 Capacity adjusting method for thick film hybrid ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56050637A JPS57166064A (en) 1981-04-06 1981-04-06 Capacity adjusting method for thick film hybrid ic

Publications (1)

Publication Number Publication Date
JPS57166064A true JPS57166064A (en) 1982-10-13

Family

ID=12864467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56050637A Pending JPS57166064A (en) 1981-04-06 1981-04-06 Capacity adjusting method for thick film hybrid ic

Country Status (1)

Country Link
JP (1) JPS57166064A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5050657A (en) * 1973-09-08 1975-05-07
JPS55105322A (en) * 1979-01-26 1980-08-12 Siemens Ag Rc circuit network and method of correcting same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5050657A (en) * 1973-09-08 1975-05-07
JPS55105322A (en) * 1979-01-26 1980-08-12 Siemens Ag Rc circuit network and method of correcting same

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